公开(公告)号：US06894592B2

公开(公告)日：2005-05-17

申请号：US10147915

申请日：2002-05-20

申请人： Jun Shen ,  Prasad S. Godavarti ,  John Stafford ,  Gordon Tam

发明人： Jun Shen ,  Prasad S. Godavarti ,  John Stafford ,  Gordon Tam

IPC分类号： H01H50/00 ,  H01H51/22 ,  H01M51/22

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.

摘要翻译： 描述了用于微加工磁性锁定开关的封装以及用于组装封装的方法。 在一个方面，衬底由相对的第一和第二表面限定。 微型开关集成电路（IC）芯片安装在第一表面。 芯片上的接触焊盘与第一表面上的迹线耦合。 永久磁铁定位成紧邻芯片。 盖子连接到第一表面。 盖的内表面形成外壳以将芯片封装在第一表面上。 芯片可以替代地安装到盖的内表面。 该芯片可以以标准或倒装芯片方式定向。 另一方面，可移动的微加工悬臂由衬底的表面支撑。 盖子贴在表面上。 盖的内表面形成在衬底的表面上包围悬臂的外壳。 永磁体与悬臂紧邻。 电磁铁连接到盖的内表面或外表面。

公开(公告)号：US07250838B2

公开(公告)日：2007-07-31

申请号：US11097390

申请日：2005-04-04

申请人： Jun Shen ,  Prasad S. Godavarti

发明人： Jun Shen ,  Prasad S. Godavarti

IPC分类号： H01H51/22

CPC分类号： H01H50/005 ,  H01H2050/007

摘要： A method and apparatus for packaging a plurality of micro-magnetic switches is described. A bonded substrate structure includes a first substrate, a second substrate, and a magnetic layer. The first substrate has a plurality of cantilevers formed thereon. The second substrate has a first surface that is bonded to the first substrate. Each cantilever of the plurality of cantilevers on the first substrate is housed in a corresponding space formed between the first substrate and the second substrate. The magnetic layer is formed on a second surface of the first and/or second substrate to induce a magnetization in a magnetic material of each housed cantilever. The bonded substrate structure is singulated to form a plurality of separate micro-magnetic switch packages. Each micro-magnetic switch package of the plurality of micro-magnetic switch packages includes at least one housed cantilever.

摘要翻译： 描述了用于封装多个微型磁性开关的方法和装置。 键合衬底结构包括第一衬底，第二衬底和磁性层。 第一基板具有形成在其上的多个悬臂。 第二基板具有接合到第一基板的第一表面。 第一基板上的多个悬臂的每个悬臂容纳在形成在第一基板和第二基板之间的对应空间中。 磁性层形成在第一和/或第二衬底的第二表面上，以引起每个容纳悬臂的磁性材料的磁化。 键合衬底结构被分割以形成多个单独的微磁开关封装。 多个微型磁性开关组件的每个微型磁性开关组件包括至少一个容纳的悬臂。