公开(公告)号：US3938722A

公开(公告)日：1976-02-17

申请号：US355889

申请日：1973-04-30

申请人： James E. Kelly ,  Richard F. Foulke ,  Raymond T. Fitzsimmons

发明人： James E. Kelly ,  Richard F. Foulke ,  Raymond T. Fitzsimmons

IPC分类号： B23K20/10 ,  H01L21/00 ,  B23K21/02

CPC分类号： H01L21/67144 ,  B23K20/106

摘要： An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.

摘要翻译： 一种用于将光束引线器件和倒装芯片器件接合到衬底或其他表面上的匹配导电表面上并用于将电引线接合到半导体器件，并且随后使用热压或超声波能量匹配衬底或其它表面上的导电表面的设备。 本公开的接合系统包括具有微小的球形接合表面的新颖的接合工具，其由新颖的枢转机构引起，以便以复杂的摆动运动单独且连续地接合多个电引线，这允许接合表面跟踪 围绕设备周边的可调节的矩形或其它预定的线性路径。 该系统还包括为该装置开发的调频超声波发生器和新颖的引线复合材料。