公开(公告)号：US4199415A

公开(公告)日：1980-04-22

申请号：US24583

申请日：1979-03-28

申请人： Henley F. Sterling ,  Richard A. Humphreys

发明人： Henley F. Sterling ,  Richard A. Humphreys

IPC分类号： C25D5/02 ,  H05K3/24

CPC分类号： C25D5/022 ,  H05K3/243

摘要： A method of selective plating, e.g. of gold on phosphor bronze, includes the steps of printing on the phosphor-bronze a mask which defines the area to be plated, electro-painting the unmasked areas in an electrolytic bath with an epoxy-phenolic paint, stoving the material so that the epoxy coat becomes a strongly adherent and chemically resistant layer, removing the mask produced in the first step in a suitable solvent, leaving the metal to be plated bare, and electro-plating. The epoxy coating may be left in situ or removed.

摘要翻译： 选择性电镀的方法，例如 在磷青铜上的金包括以下步骤：在磷青铜上印刷限定待镀区域的面罩，用环氧酚醛漆在电解槽中电镀未掩蔽区域，烘烤材料，使环氧树脂 涂层成为强粘附和耐化学腐蚀的层，将合适的溶剂中的第一步产生的掩模除去，使待镀金属裸露和电镀。 环氧涂层可以留在原位或去除。