公开(公告)号：US07960804B1

公开(公告)日：2011-06-14

申请号：US12152129

申请日：2008-05-08

Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

IPC: H01L21/00

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00333 ,  B81C2203/0154 ,  H01H2059/0045

Abstract: A latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved.

Abstract translation: 公开了一种特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。

公开(公告)号：US07617577B2

公开(公告)日：2009-11-17

申请号：US11216261

申请日：2005-08-31

Applicant: John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

Inventor： John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

IPC: H01G7/00

CPC classification number: H01G5/18 ,  G11C11/565 ,  H01L28/60 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4908

Abstract: A digital variable capacitor package is provided as having a ground plane disposed on predetermined portion of the top surface of a substrate. An elongated signal electrode may also be disposed on the substrate and including a first end defining an input and a second end extending to a substantially central region of the top surface of the substrate. This elongated signal electrode is disposed to be electrically isolated from the ground plane. A number of elongated cantilevers are disposed on the substrate and each include first ends coupled to the second end of the signal electrode and each further include second ends suspended over different predetermined portions of the ground plane. In operation, one or more of the cantilevers may be actuated to move portion thereof into close proximity to the ground plane for providing one or more discrete capacitance values.

Abstract translation: 提供数字可变电容器封装，其具有设置在基板的顶表面的预定部分上的接地平面。 细长的信号电极也可以设置在衬底上，并且包括限定输入的第一端和延伸到衬底的顶表面的大致中心区域的第二端。 该细长信号电极设置成与接地平面电隔离。 许多细长的悬臂设置在基板上，并且每个包括耦合到信号电极的第二端的第一端，并且每个还包括悬挂在接地平面的不同预定部分上的第二端。 在操作中，可以致动一个或多个悬臂以将其部分移动到靠近接地平面以提供一个或多个离散电容值。

公开(公告)号：US07145213B1

公开(公告)日：2006-12-05

申请号：US10901314

申请日：2004-07-27

Applicant: John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

Inventor： John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

IPC: H01L21/14

CPC classification number: H01H59/0009

Abstract: A capacitance coupled, transmission line-fed, radio frequency MEMS switch and its fabrication process using photoresist and other low temperature processing steps are described. The achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line(s) coupling the switch to an electrical circuit. The dielectric housing is provided with an array of sealable apertures useful for wet, but hydrofluoric acid-free, removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch—e.g. at a pressure above the high vacuum level for enhanced switch damping during operation. Alternative arrangements for sealing an array of dielectric housing apertures are included. Processing details including plan and profile drawing views, specific equipment and materials identifications, temperatures and times are also disclosed.

Abstract translation: 描述了一种电容耦合，传输线馈电，射频MEMS开关设备，可利用低温光刻胶基于晶片刻度的加工步骤。 开关装置设置在低成本的绝缘壳体中，不会对开关和将开关耦合到电路的传输线路产生不期望的电效应。 介电壳体设置有可用于湿式但不含氢氟酸的可密封孔的阵列，其除去开关制造用材料，并且在用于控制开关周围的操作气氛的处理期间也是有用的，例如在高于高压 真空度可在运行期间增强和选择开关阻尼。 包括介质壳体孔阵列的替代密封装置。 包括计划和简档图纸视图，特定设备和材料标识，温度和时间的处理细节。 MEMS开关也可以是金属接触型。

公开(公告)号：US07381583B1

公开(公告)日：2008-06-03

申请号：US10901315

申请日：2004-07-27

Applicant: John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

Inventor： John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

IPC: H01L21/00

CPC classification number: B81C1/00333 ,  B81B2201/018 ,  B81C2203/0154 ,  H01H59/0009

Abstract: A capacitance coupled, transmission line-fed, radio frequency MEMS switch and its fabrication process using photoresist and other low temperature processing steps are described. The achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line(s) coupling the switch to an electrical circuit. The dielectric housing is provided with an array of sealable apertures useful for wet, but hydrofluoric acid-free, removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch—e.g. at a pressure above the high vacuum level for enhanced switch damping during operation. Alternative arrangements for sealing an array of dielectric housing apertures are included. Processing details including plan and profile drawing views, specific equipment and materials identifications, temperatures and times are also disclosed.

Abstract translation: 描述了电容耦合，传输线馈电，射频MEMS开关及其使用光致抗蚀剂和其它低温处理步骤的制造工艺。 所实现的开关设置在低成本的绝缘壳体中，在开关上以及将开关耦合到电路的传输线上不受不利影响。 绝缘壳体设置有可用于湿的但不含氢氟酸的可密封的孔阵列，其除去开关制造所采用的材料，并且在用于控制开关周围的操作气氛的处理期间也是有用的。 在高真空水平以上的压力下，用于在运行期间增强开关阻尼。 包括用于密封绝缘壳体孔阵列的替代布置。 还披露了包括计划和剖面图，特定设备和材料标识，温度和时间在内的处理细节。

公开(公告)号：US07977137B1

公开(公告)日：2011-07-12

申请号：US12152130

申请日：2008-05-08

Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

IPC: H01L21/00

CPC classification number: H01H59/0009 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/096 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01H2059/0045

Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

Abstract translation: 公开了一种用于制造特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关的方法。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。 公开了一种基于液体去除的制造方法。

公开(公告)号：US06570750B1

公开(公告)日：2003-05-27

申请号：US09552030

申请日：2000-04-19

Applicant: Mark C. Calcatera ,  Christopher D. Lesniak ,  Richard E. Strawser

Inventor： Mark C. Calcatera ,  Christopher D. Lesniak ,  Richard E. Strawser

IPC: H01H7300

CPC classification number: H01P1/127 ,  H01G5/18 ,  H01G5/40 ,  H01H59/0009 ,  H01H2059/0027

Abstract: A micromechanical electrical systems (MEMS) metallic micromachined multiple ported electrical switch receivable on the die of an integrated circuit and within the integrated circuit package for controlling radio frequency signal paths among a plurality of switch-enabled different path choices. The switch provides desirably small signal losses in both the switch open and switch closed conditions. The switch is primarily of the single pole multiple throw mechanical type with possible use as a single input pole, multiple output poles device and provision for grounding open nodes in the interest of limiting capacitance coupling across the switch in its open condition. Cantilever beam switch element suspension is included along with normally open and normally closed switch embodiments, electrostatic switch actuation and signal coupling through the closed switch by way of increased inter electrode capacitance coupling. Switch operation from direct current to a frequency above ten gigahertz is accommodated.

Abstract translation: 一种微机电系统（MEMS）金属微加工多端口电气开关，其可接收在集成电路的管芯上并且在集成电路封装内，用于控制多个开关使能的不同路径选择中的射频信号路径。 开关在开关断开和开关闭合条件下提供期望的小信号损失。 该开关主要是单极多掷机械型，可能用作单个输入极，多个输出极设备和用于接地开路节点的设置，以便在开关状态下跨越开关限制电容耦合。 包括悬臂梁开关元件悬架以及常开和常闭开关实施例，静电开关致动和通过增加的电极间电容耦合通过闭合开关的信号耦合。 可以将直流电转换到高于十千兆赫兹的频率。

公开(公告)号：US06373007B1

公开(公告)日：2002-04-16

申请号：US09552547

申请日：2000-04-19

Applicant: Mark C. Calcatera ,  Christopher D. Lesniak ,  Richard E. Strawser

Inventor： Mark C. Calcatera ,  Christopher D. Lesniak ,  Richard E. Strawser

IPC: H01H5700

CPC classification number: H01H59/0009 ,  H01G5/18 ,  H01G5/40 ,  H01H2059/0027 ,  H01P1/184

Abstract: A micromechanical electrical systems (MEMS) metallic micromachined electrical switch usable on the die of an integrated circuit and inside the integrated circuit package for controlling radio frequency signal paths while incurring desirably small signal losses. The switch is of the single pole single throw mechanical type with provision for grounding one open-switch position node in the interest of limiting capacitance coupling across the switch in its open condition. Cantilever beam switch element suspension is included along with normally open and normally closed switch embodiments, electrostatic switch actuation and signal coupling through the closed switch by way of capacitance coupling. Low loss radio frequency operation above one gigahertz in frequency is provided.

Abstract translation: 一种微机电系统（MEMS）金属微加工电开关，其可用于集成电路的管芯和集成电路封装内，用于控制射频信号路径，同时产生理想的小信号损失。 该开关是单极单掷机械式的，用于将一个开路开关位置节点接地，以便限制开关处于开启状态的电容耦合。 包括悬臂梁开关元件悬架以及常开和常闭开关实施例，静电开关致动和通过电容耦合通过闭合开关的信号耦合。 提供频率高于1千兆赫兹的低损耗射频操作。