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    Integrated building and conveying structure for manufacturing under ultraclean conditions
    1.
    发明授权
    Integrated building and conveying structure for manufacturing under ultraclean conditions 失效
    综合建筑物输送结构，用于超声波条件下的制造

    公开(公告)号：US5344365A

    公开(公告)日：1994-09-06

    申请号：US121621

    申请日：1993-09-14

    申请人： Richard G. Scott ,  Craig R. Shackleton ,  Raymond W. Ellis

    发明人： Richard G. Scott ,  Craig R. Shackleton ,  Raymond W. Ellis

    IPC分类号： F24F7/06 ,  H01L21/677 ,  B01L1/04 ,  F24F7/007

    CPC分类号： H01L21/67712 ,  H01L21/67727

    摘要： A building houses a semiconductor manufacturing facility, which is circular in shape and is of a multi-story structure. A silo is located at the center for use in storing and transferring wafers to clean rooms disposed radially around the silo at each floor. Human access is not permitted in the silo and in the clean rooms in order to prevent contamination of the wafers. Due to the modularity of the clean room structures, clean rooms can be reconfigured easily without significant impact on the on-going manufacturing operation. The modularity also permits portions of the facility to be deactivated when not needed.

    摘要翻译： 一座建筑物是半圆形的制造设施，圆形的形状是多层结构。 仓库位于中心，用于将晶片存储和转移到在每个楼层处放置在筒仓周围的洁净室。 为了防止晶片的污染，在筒仓和洁净室中不允许人员进入。 由于洁净室结构的模块化，洁净室可以轻松重新配置，而不会对正在进行的制造操作产生重大影响。 模块化还允许设施的部分在不需要时被去激活。