公开(公告)号：US07540584B2

公开(公告)日：2009-06-02

申请号：US11095955

申请日：2005-03-31

申请人： Craig M. Bertelsen ,  Richard Michael Moore ,  Dell T. Rosa ,  Jeffery L. Sangalli ,  Jerry E. Stokesbary ,  Melissa M. Waldeck

发明人： Craig M. Bertelsen ,  Richard Michael Moore ,  Dell T. Rosa ,  Jeffery L. Sangalli ,  Jerry E. Stokesbary ,  Melissa M. Waldeck

IPC分类号： B41J2/165

CPC分类号： B41J2/17536

摘要： An orifice plate sealing tape for an orifice plate of a micro-fluid ejection device and methods for sealing an orifice plate with the sealing tape. The sealing tape includes a flexible polymeric backing film and a radiation cured adhesive applied to a surface of the orifice plate. The adhesive is cured in a pattern sufficient to seal adjacent to nozzle holes in the orifice plate and to enhance removal of the backing film and adhesive from the orifice plate prior to use of the micro-fluid ejection device. Upon removal of the sealing tape, a minimum of residue is left on the nozzle plate surface adjacent to and/or in the nozzle holes.

摘要翻译： 用于微流体喷射装置的孔板的孔板密封带和用密封带密封孔板的方法。 密封带包括柔性聚合物背衬膜和施加到孔板表面的辐射固化粘合剂。 粘合剂以足以与孔板中的喷嘴孔相邻密封的图案固化，并且在使用微流体喷射装置之前增强背衬膜和粘合剂从孔板的去除。 在去除密封带时，在喷嘴板表面上留下最少的残留物和/或在喷嘴孔中。