METHODS AND APPARATUS FOR ELECTRICALLY MODIFYING GEL ADHESION
    1.
    发明申请
    METHODS AND APPARATUS FOR ELECTRICALLY MODIFYING GEL ADHESION 有权
    电修饰凝胶粘合剂的方法和装置

    公开(公告)号:US20120325410A1

    公开(公告)日:2012-12-27

    申请号:US13570299

    申请日:2012-08-09

    IPC分类号: B32B38/10

    摘要: The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

    摘要翻译: 本发明涉及一种用于控制电场响应材料和基底之间的粘合剂结合的方法,该方法包括使用电场来控制粘合剂粘结的强度和完整性。 该方法可以用于例如从衬底去除或分层材料,该材料响应于电场。 本发明还包括消除电场的应用和将先前去除的电场响应材料应用于衬底,从而恢复粘合剂结合的强度和完整性。 本发明包括用于键控制过程的装置。

    Methods and Apparatus for Modifying Gel Adhesion Strength
    2.
    发明申请
    Methods and Apparatus for Modifying Gel Adhesion Strength 有权
    改善凝胶粘附强度的方法和装置

    公开(公告)号:US20090114344A1

    公开(公告)日:2009-05-07

    申请号:US11666567

    申请日:2005-11-01

    IPC分类号: B32B38/00

    摘要: The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

    摘要翻译: 本发明涉及一种用于控制电场响应材料和基底之间的粘合剂结合的方法,该方法包括使用电场来控制粘合剂粘结的强度和完整性。 该方法可以用于例如从衬底去除或分层材料,该材料响应于电场。 本发明还包括消除电场的应用和将先前去除的电场响应材料应用于衬底,从而恢复粘合剂结合的强度和完整性。 本发明包括用于键控制过程的装置。

    Methods and apparatus for modifying gel adhesion strength
    3.
    发明授权
    Methods and apparatus for modifying gel adhesion strength 有权
    改善凝胶粘附强度的方法和设备

    公开(公告)号:US08241458B2

    公开(公告)日:2012-08-14

    申请号:US11666567

    申请日:2005-11-01

    IPC分类号: B32B38/10

    摘要: The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

    摘要翻译: 本发明涉及一种用于控制电场响应材料和基底之间的粘合剂结合的方法,该方法包括使用电场来控制粘合剂粘结的强度和完整性。 该方法可以用于例如从衬底去除或分层材料,该材料响应于电场。 本发明还包括消除电场的应用和将先前去除的电场响应材料应用于衬底,从而恢复粘合剂结合的强度和完整性。 本发明包括用于键控制过程的装置。