公开(公告)号：US12131921B2

公开(公告)日：2024-10-29

申请号：US18012944

申请日：2021-12-13

申请人： SHINKAWA LTD.

发明人： Kohei Seyama ,  Takahiro Shimizu

IPC分类号： B32B43/00 ,  B32B41/00 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67132 ,  B32B41/00 ,  B32B43/006 ,  H01L21/6838 ,  B32B2310/028 ,  B32B2310/0831 ,  B32B2457/14 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

摘要： A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.

公开(公告)号：US09987838B2

公开(公告)日：2018-06-05

申请号：US15591201

申请日：2017-05-10

申请人： FUK Co., Ltd.

发明人： Mitsuo Uemura

IPC分类号： B32B38/10 ,  B32B43/00 ,  B23K26/402 ,  B23K103/00 ,  B32B38/18

CPC分类号： B32B43/006 ,  B23K26/402 ,  B23K2103/50 ,  B32B38/10 ,  B32B38/1858 ,  B32B2310/0843 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1174 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1978

摘要： A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

公开(公告)号：US09925756B2

公开(公告)日：2018-03-27

申请号：US15405933

申请日：2017-01-13

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Hyung Chul Lim ,  Young Gu Kim ,  Hyun Jun Cho

IPC分类号： B32B38/10 ,  B32B43/00 ,  H01L21/683 ,  H01L21/66 ,  H01L51/00 ,  H01L27/12 ,  B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  G01N21/59 ,  H01L27/32 ,  G02F1/1368 ,  G02F1/1333 ,  B23K26/362

CPC分类号： B32B43/006 ,  B23K26/009 ,  B23K26/032 ,  B23K26/0626 ,  B23K26/361 ,  B23K26/362 ,  B32B37/12 ,  B32B38/10 ,  B32B2307/416 ,  B32B2310/0843 ,  B32B2457/20 ,  G01N21/59 ,  G02F1/133305 ,  G02F1/1368 ,  H01L21/6835 ,  H01L22/20 ,  H01L27/1218 ,  H01L27/1259 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/0031 ,  H01L51/0097 ,  H01L2221/68386 ,  H01L2227/326 ,  H01L2251/5338 ,  Y10T156/1158 ,  Y10T156/1917

摘要： A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.

公开(公告)号：US09905445B2

公开(公告)日：2018-02-27

申请号：US14903741

申请日：2014-07-10

申请人： MECHATRONIC SYSTEMTECHNIK GMBH

发明人： Walter Schober

IPC分类号： B32B38/10 ,  H01L21/67 ,  H01L21/683 ,  B32B43/00

CPC分类号： H01L21/67132 ,  B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/6836 ,  H01L2221/68381 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

摘要： An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.

公开(公告)号：US09869612B2

公开(公告)日：2018-01-16

申请号：US14695108

申请日：2015-04-24

申请人： OLYMPUS CORPORATION

发明人： Nobuhiko Morimoto

IPC分类号： B32B43/00 ,  G01N1/04 ,  G01N1/08 ,  G02B21/36 ,  G01N1/31 ,  G01N21/64 ,  B32B41/00

CPC分类号： G01N1/04 ,  B32B41/00 ,  B32B43/006 ,  B32B2310/0831 ,  G01N1/08 ,  G01N1/312 ,  G01N21/6456 ,  G01N2201/025 ,  G02B21/365 ,  Y10T156/1158 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1917 ,  Y10T156/1983

摘要： The present invention provides a substrate collecting device that includes a first stage on which a sheet is placed with a plurality of substrates facing downward, an sampler which carries out a predetermined operation on some of the substrates, which are disposed at predetermined positions, from above the first stage thereby to cause the substrates to come off from the sheet and fall, an optical system and a collector disposed below the first stage, and a second stage, which integrally moves the optical system and the collector in a horizontal direction. The second stage is capable of positioning the optical system and the collector at two positions at which the optical system or the collector is disposed substantially vertically below a predetermined position.

公开(公告)号：US20170348960A1

公开(公告)日：2017-12-07

申请号：US15591201

申请日：2017-05-10

申请人： FUK Co., Ltd.

发明人： Mitsuo UEMURA

IPC分类号： B32B43/00 ,  B23K26/402 ,  B32B38/10 ,  B23K103/00

CPC分类号： B32B43/006 ,  B23K26/402 ,  B23K2103/50 ,  B32B38/10 ,  B32B38/1858 ,  B32B2310/0843 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1174 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1978

摘要： A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

公开(公告)号：US20170240717A1

公开(公告)日：2017-08-24

申请号：US15590181

申请日：2017-05-09

申请人： Immunolight, LLC.

发明人： Zakaryae FATHI ,  John PACANOVSKY ,  Frederic A. BOURKE, JR.

IPC分类号： C08J11/10 ,  B32B43/00 ,  B32B7/04 ,  B32B38/10

CPC分类号： C08J11/10 ,  B29B17/00 ,  B32B7/04 ,  B32B7/06 ,  B32B7/10 ,  B32B27/18 ,  B32B27/32 ,  B32B38/00 ,  B32B38/10 ,  B32B43/006 ,  B32B2037/1253 ,  B32B2310/0831 ,  B32B2310/085 ,  B32B2310/0887 ,  C08J2321/00 ,  Y10T156/1158 ,  Y10T156/1917

摘要： A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.

公开(公告)号：US09662872B2

公开(公告)日：2017-05-30

申请号：US15332898

申请日：2016-10-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ying-Ching Shih ,  Jing-Cheng Lin ,  Szu-Wei Lu

IPC分类号： B32B38/10 ,  B32B43/00 ,  B32B38/16 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  H01L21/683

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B38/162 ,  B32B38/1858 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/02076 ,  H01L21/02079 ,  H01L21/02096 ,  H01L21/02098 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6836 ,  H01L21/68785 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/95001 ,  Y10S901/40 ,  Y10S901/43 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1928

摘要： Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

公开(公告)号：US09578795B2

公开(公告)日：2017-02-21

申请号：US14621876

申请日：2015-02-13

申请人： LTG Green-Tech R&D Company Limited

发明人： Lei Zhang ,  Ming-Tong Wang

IPC分类号： B32B38/10 ,  H05K13/04 ,  B23K1/018 ,  H05K3/22 ,  B23K1/00 ,  B32B43/00

CPC分类号： H05K13/0486 ,  B23K1/0008 ,  B23K1/018 ,  B32B38/10 ,  B32B43/006 ,  H05K3/22 ,  H05K2203/178 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1917

摘要： A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.

摘要翻译： 一种用于提取部件的方法包括以下步骤：将具有一个或多个部件的电子设备加热到预定温度，以便基本上削弱布置成将一个或多个部件结合到电子设备上的粘合物质，然后将电子设备操作到 从电子设备中提取一个或多个组件。

公开(公告)号：US09555611B2

公开(公告)日：2017-01-31

申请号：US14518416

申请日：2014-10-20

申请人： BOE Technology Group Co., Ltd.

发明人： Chunyan Xie

IPC分类号： B32B38/10 ,  B32B43/00 ,  H01L51/00

CPC分类号： B32B43/006 ,  B32B2457/206 ,  H01L51/003 ,  H01L51/0097 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

摘要： Embodiments of the present invention provide a laser stripping apparatus, comprising: a frame; a laser located above the frame and a carrier stage located below the frame; a support mechanism provided on the carrier stage for carrying a flexible display substrate stripping plate; wherein the support mechanism is removably fixed to the carrier stage; the flexible display substrate stripping plate comprises a bearing substrate and a flexible display substrate provided on the bearing substrate; and when the flexible display substrate stripping plate is provided on the laser stripping apparatus, the flexible display substrate comes into contact with the support mechanism.

摘要翻译： 本发明的实施例提供了一种激光剥离装置，包括：框架; 位于框架上方的激光器和位于框架下方的载体台架; 在载体台上设置用于承载柔性显示基板剥离板的支撑机构; 其中所述支撑机构可移除地固定到所述载体台; 柔性显示基板剥离板包括轴承基板和设置在轴承基板上的柔性显示基板; 并且当柔性显示基板剥离板设置在激光剥离装置上时，柔性显示基板与支撑机构接触。