公开(公告)号：US4618292A

公开(公告)日：1986-10-21

申请号：US176374

申请日：1980-08-08

申请人： Robert L. Judge ,  Anthony D. Wutka

发明人： Robert L. Judge ,  Anthony D. Wutka

IPC分类号： B65G51/03 ,  H01L21/677 ,  B65G47/24

CPC分类号： H01L21/67784 ,  B65G51/03 ,  Y10S414/136

摘要： This specification deals with electro-optic controls for stopping and orienting of a semiconductor wafer being transported along a track on an air film. At one or more locations along the track the characteristics of the air film are changed by electronic controls responding to optical pickups sensing the position and orientation of a semiconductor wafer entering the particular location on the air film to first stop the wafer in the general proximity of the location, then center the wafer in the location and after the wafer is centered, quickly rotate the wafer until it assumes the desired orientation. All this is done without edge contact of the wafer by any solid objects.

摘要翻译： 该规范涉及用于停止和定向沿着空气膜上的轨道传输的半导体晶片的电光控制。 沿着轨道的一个或多个位置，通过响应于光学拾取器的电子控制来改变空气膜的特性，所述光学拾取器感测进入空气膜上的特定位置的半导体晶片的位置和取向，以首先在大致接近 的位置，然后将晶片定位在该位置，并且在晶片居中之后，快速旋转晶片直到其呈现所需的取向。 所有这些都是通过任何固体物体的晶片的边缘接触而完成的。

公开(公告)号：US4395165A

公开(公告)日：1983-07-26

申请号：US218232

申请日：1980-12-19

申请人： I. Joseph DeRobertis ,  Javathu K. Hassan ,  Robert L. Judge ,  John A. Paivanas

发明人： I. Joseph DeRobertis ,  Javathu K. Hassan ,  Robert L. Judge ,  John A. Paivanas

IPC分类号： B65G49/07 ,  B65G51/03 ,  B65H5/22 ,  H01L21/677 ,  B65G51/02

CPC分类号： H01L21/67784 ,  B65G51/03

摘要： A transport system is disclosed, including an air film shuttle conveyor for conveying semiconductor chips from a loading to an unloading station, the conveyor comprising a base plate and upstanding side guide walls extending longitudinally of the base plate, the guide walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream such that the slight spacing between the chips and the guide walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.

摘要翻译： 公开了一种运输系统，包括用于将半导体芯片从装载站运送到卸载站的空气膜穿梭式输送机，该输送机包括基板和沿基板纵向延伸的直立侧引导壁，导向壁间隔一段距离 略大于所述芯片的横向尺寸; 进一步包括提供围绕芯片的层流气流的装置，并形成支撑它们并将它们推向下游的空气膜，使得芯片和引导壁之间的轻微间隔导致在由所述第一区域限定的一个区域中的流动阻力更高 在由芯片之间的间隔限定的区域中的间隔小，由此在芯片之间发生连续且灵活的分离动作。