公开(公告)号：US5027255A

公开(公告)日：1991-06-25

申请号：US424102

申请日：1989-10-20

申请人： Dan B. Zeitlin ,  John B. Branthover ,  Brian H. Smith ,  Andrew J. Piloto ,  Theresa M. Lengel ,  Robert R. Carlson, Jr. ,  Lanson Y. Shum ,  Paul D. Hodges, Jr. ,  Denise B. Harris

发明人： Dan B. Zeitlin ,  John B. Branthover ,  Brian H. Smith ,  Andrew J. Piloto ,  Theresa M. Lengel ,  Robert R. Carlson, Jr. ,  Lanson Y. Shum ,  Paul D. Hodges, Jr. ,  Denise B. Harris

IPC分类号： H01L25/16 ,  H02M3/28 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16

CPC分类号： H01L25/162 ,  H01L25/165 ,  H02M3/28 ,  H05K1/14 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/01322 ,  H05K1/0306 ,  H05K1/142 ,  H05K1/165 ,  H05K2201/10727

摘要： A high performance, high current, miniaturized low voltage power supply is disclosed which employs a thick copper-ceramic film primary board, a direct bonded copper secondary, flexible printed circuit power inductors, the power supply has high power leadless chip carriers, hybrid rectifier packages and various electrical circuits including application specific integrated circuits for control, a turn on protection and current sharing.