摘要:
A support jig of quartz glass for receiving wafer-like substrates of semiconductor material in a vertical orientation comprises two spaced-apart circular end plates (10) which are interconnected by means of at least three transverse rods (1, 2, 3) extending in parallel with one another and between the end plates. They are provided with slots (4) for receiving the substrates, the slots (4) being open towards the substrate to be received and having a predetermined maximum slot depth, and they are arranged in a partial circle around the circular edge (5) of the end plates (10) such that an envelope (6) which encloses the partial circle on the outside projects nowhere beyond the circular edge (5). At least part of the transverse rods (1, 2, 3) have a radial cross-sectional profile which is configured as a circular form with a flattening (21, 31). The transverse rods (1, 2, 3) are arranged around the partial circle such that the flattening (21, 31) is oriented towards the circular edge of the end plates.