摘要:
A support jig of quartz glass for receiving wafer-like substrates of semiconductor material in a vertical orientation comprises two spaced-apart circular end plates (10) which are interconnected by means of at least three transverse rods (1, 2, 3) extending in parallel with one another and between the end plates. They are provided with slots (4) for receiving the substrates, the slots (4) being open towards the substrate to be received and having a predetermined maximum slot depth, and they are arranged in a partial circle around the circular edge (5) of the end plates (10) such that an envelope (6) which encloses the partial circle on the outside projects nowhere beyond the circular edge (5). At least part of the transverse rods (1, 2, 3) have a radial cross-sectional profile which is configured as a circular form with a flattening (21, 31). The transverse rods (1, 2, 3) are arranged around the partial circle such that the flattening (21, 31) is oriented towards the circular edge of the end plates.
摘要:
In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO2-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO2-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiO2 particles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO2-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO2-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic material of the components, whereby the specific density of the SiO2-containing bonding mass is at least 2.0 g/cm3.
摘要翻译:在通过物质与物质接合的用于将由高硅酸含量的材料制成的部件的已知方法中,在部件的连接表面之间形成含SiO 2的结合块。 为了提供热稳定复合材料的成本有效的制造,本发明提出产生一种关于具有高硅酸含量的材料通用的含SiO 2的粘结块,包括 以下程序步骤:提供含有无定形SiO 2颗粒的浆料; 在连接表面之间形成相对于彼此固定的位置的浆料; 干燥浆料; 以及通过在形成含SiO 2的粘合剂块的同时加热使浆料质量固化。 根据本发明的方法制造的组件组件显示出耐高温性和耐热疲劳性,并且还可以用于污染敏感的应用中。 组分组合物的特征在于含有无定形SiO 2 N 2的键合物质,其化学组成对于组分的碱性材料的高硅酸含量的材料而言是通用的,由此具体的密度 的含SiO 2的粘合物质为至少2.0g / cm 3以上。
摘要:
In a known component having a reflector layer, the surface of a base body of quartz glass is covered at least in part with a reflector layer. Starting from this, to provide a component, particularly for use in lamp and reflector manufacture, which is equipped with an efficient, chemically and thermally resistant and, nevertheless, inexpensive reflector layer, it is suggested according to the invention that an SiO2 cover layer should be provided which acts as a diffuse reflector and consists of at least partly opaque quartz glass. The method of the invention for producing such a component is characterized in that a slip which contains amorphous SiO2 particles is produced and applied to the surface of the base body with formation of a slip layer, the slip layer is dried and then vitrified with formation of an SiO2 cover layer.
摘要:
In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO2-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO2-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiO2 particles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO2-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO2-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic material of the components, whereby the specific density of the SiO2-containing bonding mass is at least 2.0 g/cm3.
摘要:
In a known component having a reflector layer, the surface of a base body of quartz glass is covered at least in part with a reflector layer. Starting from this, to provide a component, particularly for use in lamp and reflector manufacture, which is equipped with an efficient, chemically and thermally resistant and, nevertheless, inexpensive reflector layer, it is suggested according to the invention that an SiO2 cover layer should be provided which acts as a diffuse reflector and consists of at least partly opaque quartz glass.