公开(公告)号：US09184079B2

公开(公告)日：2015-11-10

申请号：US12750095

申请日：2010-03-30

申请人： Frederic Rivollier ,  Ryan Chubb

发明人： Frederic Rivollier ,  Ryan Chubb

IPC分类号： H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67781 ,  H01L21/67383 ,  H01L21/67766 ,  Y10S414/137

摘要： A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

摘要翻译： 一种用于处理晶片的系统，包括：至少一个卸载站; 设置成以一定角度保持晶片的至少一个中间站; 处理站; 以及配置成在所述站之间移动所述晶片的转移装置。 中间站可以被配置为以背靠背布置接收晶片。 一种用于处理晶片的设备，包括：一方面，构造成夹持单个晶片的真空夹具; 另一方面，重力夹持器构造成在位于晶片下方并支撑一个或多个晶片并提升时。 一种处理晶片的方法，包括：卸载晶片; 将晶片转移到中间站; 将晶片从中间站传送到处理站; 处理晶片; 从处理站卸载晶片; 并将晶片重新装载在载体中，其中晶片由转移装置卸载，转移和重新装载。

公开(公告)号：US20100272544A1

公开(公告)日：2010-10-28

申请号：US12750095

申请日：2010-03-30

申请人： Frederic Rivollier ,  Ryan Chubb

发明人： Frederic Rivollier ,  Ryan Chubb

IPC分类号： H01L31/18 ,  H01L21/677 ,  H01L21/683 ,  B65G65/00

CPC分类号： H01L21/67781 ,  H01L21/67383 ,  H01L21/67766 ,  Y10S414/137

摘要： A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

摘要翻译： 一种用于处理晶片的系统，包括：至少一个卸载站; 设置成以一定角度保持晶片的至少一个中间站; 处理站; 以及配置成在所述站之间移动所述晶片的转移装置。 中间站可以被配置为以背靠背布置接收晶片。 一种用于处理晶片的设备，包括：一方面，构造成夹持单个晶片的真空夹具; 另一方面，重力夹持器构造成在位于晶片下方并支撑一个或多个晶片并提升时。 一种处理晶片的方法，包括：卸载晶片; 将晶片转移到中间站; 将晶片从中间站传送到处理站; 处理晶片; 从处理站卸载晶片; 并将晶片重新装载在载体中，其中晶片由转移装置卸载，转移和重新装载。