公开(公告)号：US20190160690A1

公开(公告)日：2019-05-30

申请号：US16201539

申请日：2018-11-27

申请人： Brooks Automation, Inc.

发明人： Ulysses GILCHRIST ,  Jairo Terra MOURA

IPC分类号： B25J15/00 ,  H01L21/677 ,  B25J18/00 ,  H01L21/687

CPC分类号： B25J15/00 ,  B25J18/00 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/6875 ,  H01L21/68757 ,  Y10S901/30

摘要： A substrate transport apparatus for transporting substrates, the substrate transport apparatus including a frame, at least one transfer arm connected to the frame, at least one end effector mounted to the at least one transfer arm and at least one substrate support pad disposed on the at least one end effector, the at least one substrate support pad has a configuration that effects increased friction force, resulting from an increased friction coefficient, in at least one predetermined direction.

公开(公告)号：US20190096736A1

公开(公告)日：2019-03-28

申请号：US16132780

申请日：2018-09-17

申请人： PIOTECH CO., LTD.

发明人： Ren Zhou ,  Xuyen Pham ,  Shichai Fang

IPC分类号： H01L21/687 ,  H01L21/67

CPC分类号： H01L21/68714 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/6875 ,  H01L21/68785

摘要： The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.

公开(公告)号：US20190035670A1

公开(公告)日：2019-01-31

申请号：US16072045

申请日：2017-01-27

申请人： DAIHEN CORPORATION

发明人： Kentaro OKAMOTO

IPC分类号： H01L21/687 ,  H01L21/677 ,  H05K9/00

CPC分类号： H01L21/68707 ,  B25J15/0014 ,  B25J15/0052 ,  B65G49/061 ,  H01L21/67742 ,  H01L21/67766 ,  H05K9/0079

摘要： A substrate transfer hand is provided that is capable of supporting a substrate in a rigid state while reducing the contact points with the substrate.A substrate transfer hand includes a longitudinal hand support 20a extending in a longitudinal direction, and a plurality of transverse hand supports 31a and 32a coupled to the longitudinal hand support 20a and extending transversely to the longitudinal direction of the longitudinal hand support 20a. The plurality of transverse hand supports 31a and 32a include a plurality of first transverse hand supports 31a and a plurality of second transverse hand supports 32a. Each of the first transverse hand supports 31a includes a plurality of first contact points 40A aligned in a direction in which the first transverse hand support 31a extends and capable of contacting the substrate SB. The maximum height position of the first contact points 40A is a first height. Each of the second transverse hand supports 32a includes a plurality of second contact points 40B aligned in a direction in which the second transverse hand support 32a extends and capable of contacting the substrate SB. The maximum height position of the second contact points 40B is a second height that is lower than the first height.

公开(公告)号：US20190027389A1

公开(公告)日：2019-01-24

申请号：US16011978

申请日：2018-06-19

申请人： Brooks Automation, Inc.

发明人： Jairo T. MOURA ,  Aaron GAWLIK ,  Reza SAEIDPOURAZAR

IPC分类号： H01L21/677 ,  H01L21/687 ,  H01L21/68 ,  H01L21/67

CPC分类号： H01L21/67742 ,  H01L21/67265 ,  H01L21/67294 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/68707

摘要： A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.

公开(公告)号：US10083851B2

公开(公告)日：2018-09-25

申请号：US14917699

申请日：2014-09-04

申请人： KAWASAKI JUKOGYO KABUSHIKI KAISHA

发明人： Takahiro Inada ,  Hirohiko Goto ,  Masayuki Saito ,  Takeshi Shibata ,  Takayuki Fukushima

IPC分类号： B25J9/00 ,  H01L21/677 ,  H01L21/687 ,  B25J19/00 ,  F16C29/08 ,  F16C29/02

CPC分类号： H01L21/68707 ,  B25J9/0021 ,  B25J19/0079 ,  F16C29/02 ,  F16C29/088 ,  H01L21/67766

摘要： A seal belt includes inner and outer belt sections. The inner belt section revolves according to the movable member movement. The outer belt section includes, between the inner belt section and an opening, a first portion in which a first end is retained at a movable member inside section portion, the portion being closer to the opening lower end, and the remaining portion extends along the opening and is retained at a third space position, and a second portion in which a first end is retained at an inside section portion, the portion being closer to the lower end, and the remaining portion extends to a fourth space position along the opening and is retained at the fourth space position. The first portion and second portions lengths are changed in a complementary manner according to the movable member movement. The drive mechanism is surrounded by the inner belt section.

公开(公告)号：US20180261484A1

公开(公告)日：2018-09-13

申请号：US15573836

申请日：2016-05-14

申请人： Verselus, LLC

发明人： Christopher Martin ,  Troy Kreger ,  Neil Brumberger ,  Philip Hobden

IPC分类号： H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67766 ,  B25J15/0616 ,  B25J15/0683 ,  B25J17/0208 ,  B65H2555/31 ,  H01L21/6838 ,  H01L21/68707

摘要： A paddle assembly is disclosed for holding an object during manufacture i.e., in a manufacturing environment. The paddle assembly comprises a first plate and a second plate, together forming a paddle having a longitudinal axis and defining a groove configured to engage the object on a peripheral edge thereof and seat the object along the longitudinal axis and a first pin between the first and second plates adjacent the groove, the first pin configured to align the object within the groove along the longitudinal axis.

公开(公告)号：US20180253007A1

公开(公告)日：2018-09-06

申请号：US15760206

申请日：2016-08-26

申请人： TOKYO ELECTRON LIMITED

发明人： Teruhiko KODAMA ,  Masashi ENOMOTO ,  Masahide TADOKORO ,  Takafumi HASHIMOTO

IPC分类号： G03F7/16 ,  G01B11/02 ,  H01L21/66 ,  H01L21/02 ,  H01L21/027 ,  G03F7/11

CPC分类号： G03F7/162 ,  B05C9/14 ,  B05C11/08 ,  G01B11/022 ,  G01B11/06 ,  G01B11/2433 ,  G03F7/11 ,  G03F7/168 ,  H01L21/02115 ,  H01L21/02282 ,  H01L21/0271 ,  H01L21/0276 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/681 ,  H01L22/12 ,  H01L22/20

摘要： A substrate processing method, includes acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate, forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution, and forming a resist film on the entire surface of the underlayer

公开(公告)号：US20180211856A1

公开(公告)日：2018-07-26

申请号：US15876300

申请日：2018-01-22

申请人： SPTS Technologies Limited

发明人： JOHN MACNEIL ,  MARTIN AYRES ,  TREVOR THOMAS

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C25D17/00 ,  C25D17/06

CPC分类号： H01L21/67196 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/2885 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/6723 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/68707

摘要： An apparatus for processing a front face of a semiconductor wafer is provided. The apparatus includes a main chamber, at least one loading port connected to the main chamber for introducing the wafer to the main chamber, at least one stack of wafer processing modules, and a transfer mechanism for transferring the wafer between the loading port and the processing modules. The at least one stack of wafer processing modules includes three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50 cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module.

公开(公告)号：US20180203434A1

公开(公告)日：2018-07-19

申请号：US15868753

申请日：2018-01-11

申请人： EBARA CORPORATION

发明人： Koji NONOBE ,  Takashi MITSUYA ,  Ryuya KOIZUMI ,  Kunio OISHI

IPC分类号： G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

CPC分类号： G05B19/4155 ,  G05B19/41865 ,  G05B2219/32252 ,  G05B2219/45031 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67745 ,  H01L21/67766 ,  H01L21/67778 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/28

摘要： A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US09997387B2

公开(公告)日：2018-06-12

申请号：US15319092

申请日：2015-04-22

申请人： MURATA MACHINERY, LTD.

发明人： Masanao Murata ,  Takashi Yamaji ,  Shinji Onishi

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67389 ,  H01L21/673 ,  H01L21/67373 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67766 ,  H01L21/67769

摘要： A purge device configured to purge the inside of a storage container storing a product with purge gas includes a plurality of placing units, each configured to place the storage container thereon, a plurality of supply pipes configured to supply purge gas to the storage container placed on the corresponding placing unit, a main pipe connected to the supply pipes and configured to supply the purge gas to the supply pipes, and an MFC configured to adjust the flow rate of the purge gas in the main pipe.