DEVICE FOR ASSEMBLING CAMERA MODULE WITH HIGH QUALITY
    1.
    发明申请
    DEVICE FOR ASSEMBLING CAMERA MODULE WITH HIGH QUALITY 审中-公开
    用于组装高品质摄像机模块的装置

    公开(公告)号:US20140048997A1

    公开(公告)日:2014-02-20

    申请号:US13654635

    申请日:2012-10-18

    IPC分类号: B23Q3/00

    摘要: A device for assembling a camera module includes a base and a buffer layer. The camera module includes a flexible printed circuit board (FPCB), a lens module positioned on the FPCB, and a stiffener adhering to the FPCB, opposite to the lens module. The lens module includes a first stepped surface facing away from the FPCB. The base includes a supporting surface for supporting the FPCB and defines a holding groove in the supporting surface for holding the lens module. The holding groove forms a second stepped surface for supporting the first stepped surface. The buffer layer is positioned on the second stepped surface and is elastically compressed when the camera module is subjected to a hot pressing process, which secures the stiffener adhering to the FPCB, to provide relief against, and extend the duration of, various pressures applied to the camera module.

    摘要翻译: 用于组装相机模块的装置包括基座和缓冲层。 相机模块包括柔性印刷电路板(FPCB),位于FPCB上的透镜模块和与透镜模块相对的FPCB附着的加强件。 透镜模块包括背离FPCB的第一台阶表面。 基座包括用于支撑FPCB的支撑表面,并且在支撑表面中限定用于保持透镜模块的保持槽。 保持槽形成用于支撑第一台阶表面的第二台阶表面。 缓冲层定位在第二台阶表面上,并且当照相机模块进行热压加工时,弹性地压缩,这固定加固件粘附到FPCB上,以提供抵抗和延长施加到 相机模块。

    Camera module having colloid layer surrounding sensor
    2.
    发明授权
    Camera module having colloid layer surrounding sensor 有权
    相机模块具有胶体层周围的传感器

    公开(公告)号:US07744296B2

    公开(公告)日:2010-06-29

    申请号:US11877596

    申请日:2007-10-23

    IPC分类号: G03B17/02

    CPC分类号: G03B17/00

    摘要: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

    摘要翻译: 相机模块(200)包括透镜模块和安装有传感器的基座(210)。 底座设置有从其延伸的至少两个支撑突起(222)。 每个突出物定向于透镜模块,并且透镜模块固定地与至少两个支撑突起接触。 围绕传感器的胶体层夹在保持器的第二端和基座之间。 电子部件设置在电路板上并被胶体层覆盖。

    CAMERA MODULE
    3.
    发明申请
    CAMERA MODULE 有权
    相机模块

    公开(公告)号:US20080279547A1

    公开(公告)日:2008-11-13

    申请号:US11877596

    申请日:2007-10-23

    IPC分类号: G03B17/00

    CPC分类号: G03B17/00

    摘要: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

    摘要翻译: 相机模块(200)包括透镜模块和安装有传感器的基座(210)。 底座设置有从其延伸的至少两个支撑突起(222)。 每个突出物定向于透镜模块,并且透镜模块固定地与至少两个支撑突起接触。 围绕传感器的胶体层夹在保持器的第二端和基座之间。 电子部件设置在电路板上并被胶体层覆盖。