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公开(公告)号：US12121029B2
公开(公告)日：2024-10-22
申请号：US17566977
申请日：2021-12-31
摘要： This invention relates to an antimicrobial product containing silver-copper particles and its preparation method. The product includes a substrate and positively charged silver particles with a particle size of 15 μm to 50 μm, and a positively charged copper particle with a particle size of 10 μm to 50 μm, wherein the copper particle size ratio to the silver particle is 0.8 to 1.2. The silver particle, the copper particle and the substrate are combined by means of semi-fused sintering, wherein the ratio of the silver particle to the copper particle is 40:60 to 95:5. The sum of the substrate, the silver particles and the total particles of the copper particles is less than or equal to 10%.
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公开(公告)号：US20210395922A1
公开(公告)日：2021-12-23
申请号：US17385037
申请日：2021-07-26
IPC分类号： D01F1/10 , D03D15/587 , D01D5/08 , D02G3/04
摘要： This application relates to a hot-melt fiber containing silver particles, a preparation method thereof, and an article containing the hot-melt fiber.
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公开(公告)号：US20230097291A1
公开(公告)日：2023-03-30
申请号：US17566977
申请日：2021-12-31
摘要： This invention relates to an antimicrobial product containing silver-copper particles and its preparation method. The product includes a substrate and positively charged silver particles with a particle size of 15 μm to 50 μm, and a positively charged copper particle with a particle size of 10 μm to 50 μm, wherein the copper particle size ratio to the silver particle is 0.8 to 1.2. The silver particle, the copper particle and the substrate are combined by means of semi-fused sintering, wherein the ratio of the silver particle to the copper particle is 40:60 to 95:5. The sum of the substrate, the silver particles and the total particles of the copper particles is less than or equal to 10%.
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