公开(公告)号：US10759169B2

公开(公告)日：2020-09-01

申请号：US16357100

申请日：2019-03-18

申请人： STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNAITONAL N.V. ,  STMICROELECTRONICS S.R.L.

发明人： Simon Dodd ,  David S. Hunt ,  Joseph Edward Scheffelin ,  Dana Gruenbacher ,  Stefan H. Hollinger ,  Uwe Schober ,  Peter Janouch

IPC分类号： B41J2/14 ,  B41J2/175

摘要： The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.