公开(公告)号：US20110067841A1

公开(公告)日：2011-03-24

申请号：US12566042

申请日：2009-09-24

Applicant: YOUNG M. DOO ,  MARK D. KORICH ,  STUART MORIWAKI ,  KONSTANTINOS TRIANTOS

Inventor： YOUNG M. DOO ,  MARK D. KORICH ,  STUART MORIWAKI ,  KONSTANTINOS TRIANTOS

IPC: F28D15/00 ,  F28F3/04 ,  F28F7/00

CPC classification number: H05K7/20254

Abstract: A heat sink is provided for that eliminates inefficient coolant bypass channels. The heat sink comprises a coolant cavity that is defined by a cover and a body portion. The thermally conductive cover includes a first plurality of substantially uniformly dispersed pin fins that extend at an angle from the inside surface of the cover towards a section of the body portion that is opposite the cover. The body portion opposite the cover includes a second plurality of pin fins that extend in the opposite direction from the first plurality. The coolant cavity also includes thermal bosses that protrude from an inside surface of the body portion. The bosses run parallel to the first and second plurality of pin fins and extend from a point near the thermally conductive cover to the section of the thermally conductive body portion that is opposite to the thermally conductive cover.

Abstract translation: 提供了一种散热器，可以消除低效的冷却剂旁路通道。 散热器包括由盖和主体部分限定的冷却剂腔。 导热盖包括第一多个基本上均匀分散的销翅片，其从盖的内表面向与盖相对的主体部分的一部分延伸一定角度。 与盖相对的主体部分包括沿与第一多个相反的方向延伸的第二多个销翅片。 冷却剂腔还包括从主体部分的内表面突出的热凸起部。 凸台平行于第一和第二多个销散热件延伸，并从导热盖附近的点延伸到与导热盖相对的导热体部分的部分。