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公开(公告)号:US06601773B2
公开(公告)日:2003-08-05
申请号:US10078072
申请日:2002-02-14
申请人: Masanobu Saitoh , Kiyoshi Koyama , Yoshinori Touya , Sadahiro Takizawa , Kazuaki Shikichi , Shigeya Ishigaki , Hirokazu Izaki , Hiroshi Mukaiyama , Osamu Kuwabara , Haruhisa Yamasaki , Satoshi Imai
发明人: Masanobu Saitoh , Kiyoshi Koyama , Yoshinori Touya , Sadahiro Takizawa , Kazuaki Shikichi , Shigeya Ishigaki , Hirokazu Izaki , Hiroshi Mukaiyama , Osamu Kuwabara , Haruhisa Yamasaki , Satoshi Imai
IPC分类号: G05D2300
CPC分类号: F24H9/2007 , F24D19/1054 , F24H4/04 , F25B9/008 , F25B2309/061
摘要: A heat pump type hot water supply apparatus (10) for heating water by refrigerant heat and stocking the hot water thus achieved including: a heat pump unit (11) having a refrigerant circuit using natural refrigerant, the refrigerant circuit including a compressor (16) for compressing refrigerant, a heat-pump heat exchanger (18) and a refrigerant-water heat exchanger (27) for performing the heat exchange between refrigerant and water to achieve hot water; a hot water supply unit (12) including a hot water supply tank (26) for stocking the hot water achieved by the refrigerant-water heat exchanger (27) of the heat pump unit (11) and supplying the hot water thus stocked; and a water pipe (36) through which the refrigerant-water heat exchanger (27) of the heat pump unit (11) and the hot water supply tank (26) of the hot water supply unit (12) are connected to each other to circulate hot-water/water between the refrigerant-water heat exchanger (27) and said hot water supply tank (26).