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公开(公告)号：US3987823A
公开(公告)日：1976-10-26
申请号：US635870
申请日：1975-11-28
IPC分类号： B21F15/00 , H01R43/033
CPC分类号： B21F15/00 , H01R43/033 , Y10T29/53235
摘要： The present disclosure describes a wire guide for use with a manually operated wire wrap gun. Such guns are used to make solderless wrapped connections on terminals emanating from a circuit board. The wire guide of the present invention is especially useful with multi-spindle guns, such as the dual spindle gun utilized for simultaneously wrapping both wires of a twisted pair or miniature coaxial cable. The present wire guide which is fastened to the sleeve portion of the gun, permits the operator to front load the gun quickly and reliably by directing the multiple wires into the respective wire feed openings of the wrapping tool bits housed within the sleeves. Thus, the guide eliminates the tedious task of inserting wires into the gun even when the feed openings are visible to the operator; and of greater importance, it is indispensable in a front loading operation where the gun is in a fixed mounted position directed away from the operator and the openings cannot be seen, as is the case with semi-automated numerical positioning systems.
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公开(公告)号：US4033032A
公开(公告)日：1977-07-05
申请号：US751176
申请日：1976-12-16
CPC分类号： H01R12/7005 , Y10T29/53283 , Y10T29/53657 , Y10T29/53943
摘要： An extraction tool is described for use with integrated circuit (IC) packages of the type having a metallic heat sink member fused to the chip-enclosing ceramic body. The tool finds particular application in connection with a patented high package density island configuration wherein each IC package is secured on a retention post of a connector which is mounted between, and in close proximity to, adjacent parallel sections of the island cooling frame. The IC package heat sink member has at least one integral extension adapted to contact the frame. In performing its removal function, the present tool is capable of gripping opposite edges of the heat sink member in the limited space between the connector and cooling frame section. Having engaged the heat sink, the tool now permits the initial application of opposing forces respectively to the heat sink and the connector retention post. Finally, the opposing forces are directed upon the heat sink member itself, to provide the firm grasp needed for removal of the package from the connector.
摘要翻译： 描述了一种用于集成电路（IC）封装的提取工具，该集成电路封装具有熔融到封装芯片的陶瓷体的金属散热件。 该工具具有与专利的高封装密度岛结构相关的特定应用，其中每个IC封装固定在连接器的固定柱上，连接器的保持柱安装在岛冷却框架的相邻平行部分之间并且紧邻岛状冷却框架的相邻平行部分。 IC封装散热构件具有适于接触框架的至少一个整体延伸部。 在执行其去除功能时，本工具能够在连接器和冷却框架部分之间的有限空间中夹持散热构件的相对边缘。 已经接合散热器，该工具现在允许分别将相对的力分别施加到散热器和连接器固定柱。 最后，相反的力指向散热构件本身，以提供从连接器移除包装所需的牢固把握。
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