公开(公告)号：US20210109290A1

公开(公告)日：2021-04-15

申请号：US16989448

申请日：2020-08-10

申请人： Lionel C. KIMERLING ,  Jurgen MICHEL ,  Anuradha M. AGARWAL ,  Kazumi WADA ,  Drew Michael Weninger ,  Samuel Serna

发明人： Lionel C. KIMERLING ,  Jurgen MICHEL ,  Anuradha M. AGARWAL ,  Kazumi WADA ,  Drew Michael Weninger ,  Samuel Serna

IPC分类号： G02B6/30

摘要： Optical interconnects can offer higher bandwidth, lower power, lower cost, and higher latency than electrical interconnects alone. The optical interconnect system enables both optical and electrical interconnection, leverages existing fabrication processes to facilitate package-level integration, and delivers high alignment tolerance and low coupling losses. The optical interconnect system provides connections between a photonics integrated chip (PIC) and a chip carrier and between the chip carrier and external circuitry. The system provides a single flip chip interconnection between external circuitry and a chip carrier using a ball grid array (BGA) infrastructure. The system uses graded index (GRIN) lenses and cross-taper waveguide couplers to optically couple components, delivers coupling losses of less than 0.5 dB with an alignment tolerance of ±1 μm, and accommodates a 2.5× higher bandwidth density.