公开(公告)号：US20080198534A1

公开(公告)日：2008-08-21

申请号：US12071292

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/02

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

公开(公告)号：US20080198533A1

公开(公告)日：2008-08-21

申请号：US12071296

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G4/06

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

公开(公告)号：US07859824B2

公开(公告)日：2010-12-28

申请号：US12071296

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/025

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

摘要翻译： 公开了一种固体电容器及其制造方法。 固体电容器由介电层和两个电极构成。 在介电层的表面上设置有由开口工序形成的多个孔。 两个电极通过孔与电介质层连接。 通过多个高温挥发物质，在烧结过程中，多个孔形成在电介质层的表面上。 孔与外部连接，以增加介电层的表面积，进一步提高容量。 固体电容器通过物理手段存储电荷。 此外，固体电容器可以重复堆叠成为多层电容器。

公开(公告)号：US07495891B2

公开(公告)日：2009-02-24

申请号：US11274129

申请日：2005-11-16

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/02

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

摘要翻译： 公开了一种固体电容器及其制造方法。 固体电容器由介电层和两个电极构成。 在介电层的表面上设置有由开口工序形成的多个孔。 两个电极通过孔与电介质层连接。 通过多个高温挥发物质，在烧结过程中，多个孔形成在电介质层的表面上。 孔与外部连接，以增加介电层的表面积，进一步提高容量。 固体电容器通过物理手段存储电荷。 此外，固体电容器可以重复堆叠成为多层电容器。

公开(公告)号：US07848082B2

公开(公告)日：2010-12-07

申请号：US12071292

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/02

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

公开(公告)号：US20080198532A1

公开(公告)日：2008-08-21

申请号：US12071299

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/00

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

公开(公告)号：US07457104B2

公开(公告)日：2008-11-25

申请号：US12071299

申请日：2008-02-20

申请人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

发明人： Shang Mei Lee ,  Ting Keng Lin ,  Yung Sheng Huang

IPC分类号： H01G9/00

CPC分类号： H01G4/12 ,  H01G4/018 ,  H01G4/30 ,  Y10T29/41 ,  Y10T29/417

摘要： A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

摘要翻译： 公开了一种固体电容器及其制造方法。 固体电容器由介电层和两个电极构成。 在介电层的表面上设置有由开口工序形成的多个孔。 两个电极通过孔与电介质层连接。 通过多个高温挥发物质，在烧结过程中，多个孔形成在电介质层的表面上。 孔与外部连接，以增加介电层的表面积，进一步提高容量。 固体电容器通过物理手段存储电荷。 此外，固体电容器可以重复堆叠成为多层电容器。