-
公开(公告)号：US20240331947A1
公开(公告)日：2024-10-03
申请号：US18592258
申请日：2024-02-29
发明人： Beomjoon Cho
摘要： An electronic component includes: a first capacitor; and at least one second capacitor that is disposed on the first capacitor along a stacking direction. Each of the first capacitor and the second capacitor includes a dielectric layer and a plurality of internal electrodes spaced apart from each other with the dielectric layer interposed therebetween and disposed in the stacking direction. A distance between the plurality of internal electrodes according to the stacking direction in the first capacitor is greater than a distance between the plurality of internal electrodes according to the stacking direction in the second capacitor.
-
公开(公告)号：US20240331946A1
公开(公告)日：2024-10-03
申请号：US18235064
申请日：2023-08-17
发明人： Chung Yeol LEE , Jun Il KANG , Hee Jung JUNG , Jong Rock LEE , Cheong KIM , Hiroki OKADA
摘要： A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.
-
公开(公告)号：US20240312718A1
公开(公告)日：2024-09-19
申请号：US18583094
申请日：2024-02-21
发明人： So Jung AN , Hyung Jong CHOI , Jung Won PARK , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.
-
公开(公告)号：US20240296996A1
公开(公告)日：2024-09-05
申请号：US18210936
申请日：2023-06-16
发明人： Kwang Dong Seong , Young Ah Song , Bong Gyu Choi , Do Kyeong Lee , Jae Hoon Bang , Wan Sik Kim
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a conductive metal and glass, and wherein at least a portion of the glass includes a secondary phase of the glass including barium (Ba), aluminum (Al), and silicon (Si).
-
公开(公告)号：US20240274368A1
公开(公告)日：2024-08-15
申请号：US18645795
申请日：2024-04-25
发明人： Tae Gyeom LEE , Gi Long KIM , Seon Jae MUN , Byung Rok AHN , Kyoung Jin CHA
摘要： A multilayer electronic component according to another exemplary embodiment of the present disclosure may suppress occurrence of a short circuit between the internal electrodes, lower capacitance or reduced breakdown voltage by controlling an area fraction of a region of a capacitance formation portion, in which a range of brightness intensity is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion.
-
公开(公告)号：US20240258035A1
公开(公告)日：2024-08-01
申请号：US18422495
申请日：2024-01-25
发明人： Yuji Tomizawa , Yasuhito Hagiwara
CPC分类号： H01G4/2325 , H01G4/224 , H01G4/248 , H01G4/306 , H01G4/12
摘要： Provided is a multilayer ceramic electronic component including a ceramic element having a multilayer body in which internal electrodes are stacked with interposition of a dielectric layer and the internal electrodes are led out in a direction orthogonal to a stacking direction, and a protective part located at least on upper and lower surfaces of the multilayer body in the stacking direction, an underlying electrode layer formed at least on part of a surface of the protective part on either one or both of upper and lower sides in the stacking direction, a covering layer that covers an end part or a rim part of the underlying electrode layer, a plating layer that covers at least an upper surface of the underlying electrode layer, and at least a pair of external electrodes having the underlying electrode layer and the plating layer and being electrically connected to the internal electrodes.
-
公开(公告)号：US12051548B2
公开(公告)日：2024-07-30
申请号：US18194675
申请日：2023-04-03
发明人： Michael W. Kirk , Marianne Berolini
CPC分类号： H01G4/38 , H01G4/12 , H01G4/40 , H01L27/0805 , H01L28/60
摘要： A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.
-
公开(公告)号：US20240242887A1
公开(公告)日：2024-07-18
申请号：US18621196
申请日：2024-03-29
摘要： When a multilayer ceramic capacitor is viewed as a section of a central portion in a width direction cut parallel or substantially parallel or substantially parallel or substantially parallel to a side surface, in an internal electrode layer in a central portion in a lamination direction and including an extremity spaced apart from an end surface, any one of five segments of the internal electrode layer that are horizontally and successively positioned from the extremity has a length greater than about 0.2 times of an average length of ten segments of the internal electrode layer that are horizontally and successively positioned in a central portion in a length direction.
-
公开(公告)号：US20240234030A1
公开(公告)日：2024-07-11
申请号：US18618166
申请日：2024-03-27
发明人： Tatsunori YASUDA , Kazuki KUROKAWA
摘要： A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers each alternately laminated with ceramic layers and exposed at a respective end surface, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at a first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at a second end surface. The first step layers each have a thickness in a height direction of the multilayer body greater at a location closer to the first main surface than the second main surface, and the second step layers each have a thickness in the height direction of the multilayer body greater at a location closer to the first main surface than the second main surface.
-
公开(公告)号：US12033802B2
公开(公告)日：2024-07-09
申请号：US17569815
申请日：2022-01-06
申请人： TDK CORPORATION
发明人： Toru Onoue , Daisuke Himeta , Yusuke Karasawa
摘要： In the sintered electrode layer covering the one end face, a wraparound dimension of a wraparound portion wrapping around from the one end face to the one main face in the facing direction is set to a dimension b, a distance between the one end face and the end portions of the plurality of second internal electrodes on the one end face side in the facing direction is set to a dimension Lg, a distance between the pair of main faces in the stacking direction is set to a dimension T, and a distance between the one main face and the second internal electrode closest to the one main face is set to a dimension Tg1, a relational expression of Lg>b−(2×b×Tg1/T) is satisfied.
-
-
-
-
-
-
-
-
-
搜索结果
2390 条记录 (耗时 0.024 秒)
