公开(公告)号：US20090162947A1

公开(公告)日：2009-06-25

申请号：US11960662

申请日：2007-12-19

申请人： Christopher W. Bergevin ,  Shawn M. Collier Hernandez

发明人： Christopher W. Bergevin ,  Shawn M. Collier Hernandez

IPC分类号： H01L21/00

CPC分类号： H01L21/67051

摘要： Wafer structures and associated methods of fabrication are described. The wafer structures are fabricated to have aerodynamic shapes. Even if the structures on the wafer are fragile, the aerodynamic shapes of the structures create less resistance to a fluid flow of a cleaning process, and are less likely to be damaged by the cleaning process. Also, the aerodynamic shape of the structures allows a fluid flow to be directed toward the wafer from a single angle to effectively clean the wafer.

摘要翻译： 描述了晶片结构和相关的制造方法。 制造晶片结构以具有空气动力学形状。 即使晶片上的结构是脆弱的，结构的空气动力学形状对清洁过程的流体流动产生较小的阻力，并且不太可能被清洁过程损坏。 此外，结构的空气动力学形状允许流体流从单个角度指向晶片，以有效地清洁晶片。

公开(公告)号：US07651952B2

公开(公告)日：2010-01-26

申请号：US11960662

申请日：2007-12-19

申请人： Christopher W. Bergevin ,  Shawn M. Collier Hernandez

发明人： Christopher W. Bergevin ,  Shawn M. Collier Hernandez

IPC分类号： H01L21/461

CPC分类号： H01L21/67051

摘要： Wafer structures and associated methods of fabrication are described. The wafer structures are fabricated to have aerodynamic shapes. Even if the structures on the wafer are fragile, the aerodynamic shapes of the structures create less resistance to a fluid flow of a cleaning process, and are less likely to be damaged by the cleaning process. Also, the aerodynamic shape of the structures allows a fluid flow to be directed toward the wafer from a single angle to effectively clean the wafer.

摘要翻译： 描述了晶片结构和相关的制造方法。 制造晶片结构以具有空气动力学形状。 即使晶片上的结构是脆弱的，结构的空气动力学形状对清洁过程的流体流动产生较小的阻力，并且不太可能被清洁过程损坏。 此外，结构的空气动力学形状允许流体流从单个角度指向晶片，以有效地清洁晶片。