Heat-dissipating casing of electronic apparatus
    1.
    发明授权
    Heat-dissipating casing of electronic apparatus 有权
    电子设备散热外壳

    公开(公告)号:US06820686B2

    公开(公告)日:2004-11-23

    申请号:US10434208

    申请日:2003-05-09

    CPC classification number: H05K5/0247 H05K7/209

    Abstract: A heat-dissipating casing of an electronic apparatus having an input device, an output device, and a printed circuit board connected with the input device and the output device is disclosed. The heat-dissipating casing includes a metal extruded casing having at least four surfaces to form a space, a first opening and a second opening, wherein the space is used for receiving the printed circuit board, a first side plate fixed to the metal extruded casing to cover the first opening and having a first hole for securing the input device, and a second side plate fixed to the metal extruded casing to cover the second opening and having a second hole for securing the output device, thereby dissipating the heat generated from the electronic apparatus and equalizing the surface temperature of the electronic apparatus.

    Abstract translation: 公开了具有输入装置,输出装置和与输入装置和输出装置连接的印刷电路板的电子装置的散热壳体。 散热壳体包括具有至少四个表面以形成空间的金属挤压外壳,第一开口和第二开口,其中所述空间用于接收印刷电路板,固定到金属挤压外壳的第一侧板 以覆盖第一开口并具有用于固定输入装置的第一孔,以及固定到金属挤压壳体以覆盖第二开口并具有用于固定输出装置的第二孔的第二侧板,从而消散由 电子设备,并均衡电子设备的表面温度。

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