公开(公告)号：US09082804B2

公开(公告)日：2015-07-14

申请号：US13021838

申请日：2011-02-07

申请人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

发明人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

IPC分类号： H01L21/683

CPC分类号： H01L21/6831

摘要： An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.

摘要翻译： 公开了一种在去除之前更有效地从衬底去除积聚电荷的静电夹。 目前，升降针和接地引脚是用于在植入后从衬底去除电荷的唯一机制。 本公开描述了一种静电卡盘，其中顶部电介质表面具有嵌入的导电区域，例如密封环中的环形导电区域。 因此，无论衬底在释放过程中的取向如何，衬底的至少一部分将在工件支撑体的电介质层上包含导电区域。 该导电区域可以通过使用电介质层中的导电通孔而连接到地。 在一些实施例中，这些导电通孔是用于向衬底的背侧供应气体的流体导管。

公开(公告)号：US08681472B2

公开(公告)日：2014-03-25

申请号：US12487444

申请日：2009-06-18

申请人： David E. Suuronen ,  Dale K. Stone ,  Shigeo Oshiro ,  Arthur P. Riaf ,  Edward D. MacIntosh

发明人： David E. Suuronen ,  Dale K. Stone ,  Shigeo Oshiro ,  Arthur P. Riaf ,  Edward D. MacIntosh

IPC分类号： H01L21/683

CPC分类号： H01L21/67109 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/022 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01L21/6875

摘要： Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a ground pin that extends two regions of a platen that support the substrate. The ground pin may comprise a pin body; and a sleeve comprising an upper portion, a side portion, and a lower portion, the sleeve being configured to fit around the pin body, the sleeve including a fluid channel configured to transport fluid between the upper portion and the lower portion of the sleeve.

摘要翻译： 公开了用于减少衬底上的颗粒污染的技术。 在一个特定的示例性实施例中，该技术可以通过延伸支撑衬底的压板的两个区域的接地销来实现。 接地引脚可以包括引脚主体; 以及包括上部，侧部和下部的套筒，所述套筒构造成围绕销主体配合，所述套筒包括构造成在套筒的上部和下部之间输送流体的流体通道。

公开(公告)号：US20120200980A1

公开(公告)日：2012-08-09

申请号：US13021838

申请日：2011-02-07

申请人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

发明人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

IPC分类号： H05F3/02

CPC分类号： H01L21/6831

摘要： An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.

摘要翻译： 公开了一种在去除之前更有效地从衬底去除积聚电荷的静电夹。 目前，升降针和接地引脚是用于在植入后从衬底去除电荷的唯一机制。 本公开描述了一种静电卡盘，其中顶部电介质表面具有嵌入的导电区域，例如密封环中的环形导电区域。 因此，无论衬底在释放过程中的取向如何，衬底的至少一部分将包含工件支撑体的电介质层上的导电区域。 该导电区域可以通过使用电介质层中的导电通孔而连接到地。 在一些实施例中，这些导电通孔是用于向衬底的背侧供应气体的流体导管。

公开(公告)号：US20090317964A1

公开(公告)日：2009-12-24

申请号：US12487444

申请日：2009-06-18

申请人： David E. SUURONEN ,  Dale K. Stone ,  Shigeo Oshiro ,  Arthur P. Riaf ,  Edward D. MacIntosh

发明人： David E. SUURONEN ,  Dale K. Stone ,  Shigeo Oshiro ,  Arthur P. Riaf ,  Edward D. MacIntosh

IPC分类号： H01L21/265 ,  F28D15/00

CPC分类号： H01L21/67109 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/022 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01L21/6875

摘要： Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.

摘要翻译： 公开了用于减少衬底上的颗粒污染的技术。 在一个特定的示例性实施例中，该技术可以利用具有不同区域的压板来实现，其中区域中的压力水平可以基本相等。 例如，压盘可以包括压板本体，该压板本体包括第一和第二凹槽，第一凹槽限定用于保持流体的流体区域，以将衬底的温度保持在期望温度，第二凹槽限定用于保持接地电路的第一腔体 ; 第一通孔限定在压板本体中，第一通孔具有第一和第二开口，第一开口靠近流体区域，第二开口接近第一腔体，其中流体区域的压力水平可以保持在 基本上等于第一腔的压力水平。