公开(公告)号：US20240355667A1

公开(公告)日：2024-10-24

申请号：US18758576

申请日：2024-06-28

Applicant: LAM RESEARCH CORPORATION

Inventor： Haoquan YAN ,  Robert Griffith O'NEILL ,  Raphael CASAES ,  Jon MCCHESNEY ,  Alex PATERSON

IPC: H01L21/687 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01J37/023 ,  H01J37/20 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/68735

Abstract: An edge ring arrangement for a processing chamber includes a first ring configured to surround and overlap a radially outer edge of an upper plate of a pedestal arranged in the processing chamber, a second ring arranged below the first moveable ring, wherein a portion of the first ring overlaps the second ring, a first actuator configured to actuate a first pillar to selectively move the first ring to a raised position and a lowered position relative to the pedestal, and a second actuator configured to actuate a second pillar to selectively move the second ring to a raised position and a lowered position relative to the pedestal.

公开(公告)号：US12112917B2

公开(公告)日：2024-10-08

申请号：US17570802

申请日：2022-01-07

Applicant: JEOL Ltd.

Inventor： Shuichi Yuasa

IPC: H01J37/20

CPC classification number: H01J37/20 ,  H01J2237/20207

Abstract: There is provided a sample holder which is for use in a charged particle beam system and which can prevent damage to a sample stage during transportation of a cartridge. The sample holder includes: the cartridge having the sample stage for holding a sample therein; and a holder base having a mounting portion to which the cartridge can be mounted. The cartridge has: a tilt mechanism for tilting the sample stage; and a lock lever which, when the cartridge has been taken out from the mounting portion, makes contact with the sample stage and limits tilt of the stage.

公开(公告)号：US20240331971A1

公开(公告)日：2024-10-03

申请号：US18741204

申请日：2024-06-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Jurgen VAN SOEST ,  Vincent Sylvester KUIPER ,  Yinglong LI

IPC: H01J37/20 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2001

Abstract: A charged particle assessment apparatus comprising: a charged particle beam device; an actuated sample stage; a hot component and a thermal compensator. The actuated sample stage is configured to hold a sample. The hot component is configured to operate such that, during operation, heat is radiated toward a sample held on the sample holder. The hot component is smaller than the sample. The thermal compensator is configured to heat the sample so as to reduce thermal gradients therein.

公开(公告)号：US20240331969A1

公开(公告)日：2024-10-03

申请号：US18193545

申请日：2023-03-30

Applicant: FEI Company

Inventor： Chad Rue

IPC: H01J37/20 ,  C23C14/14 ,  C23C14/34 ,  H01J37/28 ,  H01J37/305

CPC classification number: H01J37/20 ,  C23C14/14 ,  C23C14/3407 ,  H01J37/28 ,  H01J37/305 ,  H01J2237/081 ,  H01J2237/20214 ,  H01J2237/31749

Abstract: To reduce charging artifacts in electron microscopy, a notched ring of sputterable material can be situated about a sample surface. An ion beam can be directed through a notch at to sputter the sputterable material onto the sample surface. Sputtering can be performed after low-angle focused ion beam (FIB) milling at the same sample tilts. The sample can be rotated about an axis and sputtering performed at multiple rotation angles. Upon sputtering of the conductive coating, the sample can be reoriented and imaged. These steps can be repeated to produce a 2D image stack for 3D image reconstruction.

公开(公告)号：US20240321543A1

公开(公告)日：2024-09-26

申请号：US18572830

申请日：2021-07-01

Applicant: Hitachi High-Tech Corporation

Inventor： Hideyuki KOTSUJI ,  Toshiyuki YOKOSUKA ,  Hajime KAWANO

IPC: H01J37/02 ,  H01J37/20 ,  H01J37/24 ,  H01J37/28

CPC classification number: H01J37/026 ,  H01J37/20 ,  H01J37/24 ,  H01J37/28 ,  H01J2237/0044 ,  H01J2237/24564

Abstract: The present disclosure provides a charged particle beam device capable of removal or control of an electric charge by plasma without affecting control of the charged particle beam. The charged particle beam device according to the present disclosure is provided with a charged particle beam optical system for emitting a charged particle beam onto a sample, a sample chamber provided with a stage on which the sample is placed, a plasma generating device for generating plasma to be emitted onto the stage so as to remove an electrification charge from the sample, and a coupling member coupling the plasma generating device to the sample chamber, the coupling member including an insulating spacer insulating the sample chamber and the plasma generating device.

公开(公告)号：US12099076B2

公开(公告)日：2024-09-24

申请号：US17651583

申请日：2022-02-18

Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor： Jiabao Chen

IPC: G01R1/04 ,  H01J37/20 ,  H01L21/683 ,  G01N23/2204

CPC classification number: G01R1/0408 ,  H01J37/20 ,  H01L21/6835 ,  G01N23/2204 ,  H01J2237/2008

Abstract: The present disclosure discloses a sample fixation mechanism for a test with a nano-probe, an apparatus for a test with a nano-probe, and a sample test method. The sample fixation mechanism includes a base having a first assembly surface; a holder having a second assembly surface matched with the first assembly surface, wherein the holder further has a fixation surface opposite to the second assembly surface, and the fixation surface is configured to be adhered and fixed with the sample; a lock structure having a locked state and an unlocked state, wherein in the locked state, the lock structure is capable of fixing the holder relative to the base, and in the unlocked state, the holder may be removed from the base.

公开(公告)号：US20240312756A1

公开(公告)日：2024-09-19

申请号：US18674282

申请日：2024-05-24

Applicant: ASML Netherlands B.V.

Inventor： Jasper Hendrik GRASMAN ,  Niels Johannes Maria BOSCH ,  Patrick Peter Hubert Helena PHILIPS ,  Peter Paul HEMPENIUS ,  Joan SANS MERCADER ,  Gerardus Wilhelmus SARS ,  Hans BUTLER ,  Willem Henk URBANUS

IPC: H01J37/20

CPC classification number: H01J37/20 ,  H01J2237/20235

Abstract: Disclosed herein is a platform for a charged particle apparatus, the platform comprising: a base frame; a chamber arranged to comprise a substrate; a metrology frame arranged to support a charged particle beam generator for irradiating a substrate in the chamber with a charged particle beam; and a bellow arranged between the metrology frame and the chamber; wherein: the chamber is rigidly connected to the base frame; the bellow comprises a flexible material such that the metrology frame is substantially isolated from any vibrations that are generated in the chamber; and the bellow is air tight so that a substantial vacuum may be established in the chamber.

公开(公告)号：US20240266141A1

公开(公告)日：2024-08-08

申请号：US18561202

申请日：2021-05-17

Applicant: Hitachi High-Tech Corporation

Inventor： Hiroyuki ASAKURA ,  Hideki KIKUCHI ,  Toshie YAGUCHI

IPC: H01J37/20 ,  H01J37/26

CPC classification number: H01J37/20 ,  H01J37/26 ,  H01J2237/20214

Abstract: A sample holder with high versatility is provided. A sample holder 100 includes a holder shaft 2, a placement unit 3 on which a sample SAM is placeable, a moving mechanism 4 that moves the holder shaft in a first direction, rotating mechanism 5 that rotates the holder shaft 2 in a first rotation direction with a center of the holder shaft 2 as a rotation axis, a protrusion unit 6 that is fixed to the holder shaft 2 so as to protrude in a second direction intersecting the first direction and whose position is changed according to the rotation and movement of the holder shaft 2, and a guide unit 7 that surrounds an outer periphery of the holder shaft 2 and whose position is not changed according to the rotation and movement of the holder shaft 2. The guide unit 7 is provided with a through hole (7a) and a through hole (7b). A width of the through hole (7a) in the first rotation direction is larger than a width of the through hole (7b) in the first rotation direction. The protrusion unit 6 is movable inside the through hole (7a) and inside the through hole (7b).

公开(公告)号：US12051607B2

公开(公告)日：2024-07-30

申请号：US17257900

申请日：2019-06-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Patriek Adrianus Alphonsus Maria Bruurs ,  Dennis Herman Caspar Van Banning ,  Jan-Gerard Cornelis Van Der Toorn ,  Edwin Cornelis Kadijk

IPC: H01L21/67 ,  G01K1/14 ,  G01K11/125 ,  H01J37/20 ,  H01J37/244 ,  H01L21/68

CPC classification number: H01L21/67248 ,  G01K1/14 ,  G01K11/125 ,  H01J37/20 ,  H01J37/244 ,  H01L21/68 ,  H01J2237/20228 ,  H01J2237/20235

Abstract: A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.

公开(公告)号：US12051562B2

公开(公告)日：2024-07-30

申请号：US17753298

申请日：2020-08-25

Applicant: ASML Netherlands B.V.

Inventor： Yixiang Wang ,  Shibing Liu ,  Shanhui Cao ,  Kangsheng Qiu ,  Juying Dou ,  Ying Luo ,  Yinglong Li ,  Qiang Li ,  Ronald Van Der Wilk ,  Jan-Gerard Cornelis Van Der Toorn

IPC: H01J37/20 ,  H01L21/683

CPC classification number: H01J37/20 ,  H01L21/6833 ,  H01J2237/0044

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.