公开(公告)号：US20130062013A1

公开(公告)日：2013-03-14

申请号：US13609757

申请日：2012-09-11

申请人： Shinji OKADA ,  Masatoshi SHIRAISHI ,  Masatoshi DEGUCHI ,  Naoto YOSHITAKA ,  Shintaro SUGIHARA ,  Masataka MATSUNAGA

发明人： Shinji OKADA ,  Masatoshi SHIRAISHI ,  Masatoshi DEGUCHI ,  Naoto YOSHITAKA ,  Shintaro SUGIHARA ,  Masataka MATSUNAGA

IPC分类号： C09J5/06

CPC分类号： H01L21/67092 ,  H01L21/67109 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/68707

摘要： A joint apparatus that joins a processing target substrate and a supporting substrate together, includes: a processing container that is capable of hermetically closing an inside thereof; a joint unit that joins the processing target substrate and the supporting substrate together by pressing the processing target substrate and the supporting substrate via an adhesive; and a superposed substrate temperature regulation unit that temperature-regulates a superposed substrate joined in the joint unit, wherein the joint unit and the superposed substrate temperature regulation unit are arranged in the processing container, A delivery unit for delivering the processing target substrate, the supporting substrate, or the superposed substrate to/from an outside of the processing container is provided in the processing container, and the superposed substrate temperature regulation unit is provided in the delivery unit.

摘要翻译： 将加工对象基板和支撑基板连接在一起的联合装置包括：能够密封其内部的处理容器; 通过粘合剂对加工对象基板和支撑基板进行加压而将加工对象基板与支撑基板接合在一起的接合单元; 以及叠加的基板温度调节单元，其对连接在所述接合单元中的叠置基板进行温度调节，其中，所述接合单元和所述叠置基板温度调节单元配置在所述处理容器中，所述输送单元用于输送所述处理对象基板， 基板或与处理容器的外部叠置的基板设置在处理容器中，并且叠置的基板温度调节单元设置在输送单元中。