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1.发明授权公开(公告)号：US09330898B2
公开(公告)日：2016-05-03
申请号：US13818150
申请日：2011-03-04
CPC分类号： H01L21/02076 , B32B38/10 , B32B43/006 , H01L21/02057 , H01L21/67051 , H01L21/67092 , Y10T156/11 , Y10T156/1132 , Y10T156/1153 , Y10T156/1168 , Y10T156/19 , Y10T156/1911 , Y10T156/1944
摘要： The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.
摘要翻译： 本发明用于将处理对象基板和支撑基板与粘合剂接合在一起的叠加基板分离到处理对象基板和支撑基板中，并且包括：对处理对象进行预定处理的分离处理站 基板，支撑基板和叠置基板; 将基板传送到分离处理站/从分离处理站传送的输入/输出站; 以及转移单元，其在所述分离处理站和所述分离处理站之间传送所述基板，其中所述分离处理站包括：分离单元，将所述叠加的基板分离成所述处理对象基板和所述支撑基板; 清洗分离单元中分离的处理对象基板的第一清洗单元; 以及清洁在分离单元中分离的支撑基板的第二清洁单元。
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公开(公告)号：US20140158303A1
公开(公告)日：2014-06-12
申请号：US14131247
申请日：2012-06-25
IPC分类号： H01L21/677
CPC分类号： H01L21/677 , H01L21/67092 , H01L21/67103
摘要： This bonding system comprises a bonding processing station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate into/out of the bonding processing station. The bonding processing station comprises a coating device which applies an adhesive to the substrate to be processed or the supporting substrate and a heat treatment device that heats the substrate, to which the adhesive has been applied. In addition, a bonding device turns over one of the substrates, and presses the overturned substrate against the other substrate with an adhesive therebetween, thereby bonding the substrates together. A conveyance region conveys the substrate(s) to the coating device, the heat treatment device and the bonding device.
摘要翻译： 该接合系统包括接合处理站和承载要处理的基板的承载/输出站，支撑基板或键合基板，其通过将待处理基板和支撑基板接合/接合而获得 加工站。 接合处理站包括对待处理基板或支撑基板施加粘合剂的涂布装置和加热粘合剂已经涂布的基板的热处理装置。 此外，接合装置翻转其中一个基板，并且将翻转的基板以其间的粘合剂压靠在另一个基板上，从而将基板粘合在一起。 输送区域将基板输送到涂布装置，热处理装置和粘合装置。
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公开(公告)号：US09165758B2
公开(公告)日：2015-10-20
申请号：US13978345
申请日：2011-12-26
IPC分类号： B32B38/10 , H01L21/02 , H01L21/67 , H01L21/687 , B32B43/00
CPC分类号： H01L21/02002 , B32B38/10 , B32B43/006 , H01L21/67051 , H01L21/67092 , H01L21/67103 , H01L21/68728 , Y10T156/1132 , Y10T156/19 , Y10T156/1944
摘要： A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus. The pressure inside a transport apparatus is a positive pressure in relation to the pressure inside the peeling device and the pressure inside the first washing apparatus.
摘要翻译： 剥离系统包括：加载/卸载待处理基板的载入/进出站，支撑基板或其中粘合的堆叠基板; 在要处理的基板上执行规定处理的剥离处理站，支撑基板和堆叠的基板; 以及设置在进/出站和剥离处理站之间的运送站。 剥离处理站具有剥离堆叠的基板的剥离装置，洗涤被处理的基板的第一洗涤装置和洗涤被剥离的支撑基板的第二清洗装置。 输送站内的压力是相对于剥离装置内的压力，第一洗涤装置内的压力和第二洗涤装置内的压力的正压。 输送装置内的压力是剥离装置内的压力和第一洗涤装置内的压力的正压。
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公开(公告)号：US20130280825A1
公开(公告)日：2013-10-24
申请号：US13978345
申请日：2011-12-26
IPC分类号： H01L21/02
CPC分类号： H01L21/02002 , B32B38/10 , B32B43/006 , H01L21/67051 , H01L21/67092 , H01L21/67103 , H01L21/68728 , Y10T156/1132 , Y10T156/19 , Y10T156/1944
摘要： A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus. The pressure inside a transport apparatus is a positive pressure in relation to the pressure inside the peeling device and the pressure inside the first washing apparatus.
摘要翻译： 剥离系统包括：加载/卸载待处理基板的载入/进出站，支撑基板或其中粘合的堆叠基板; 在要处理的基板上执行规定处理的剥离处理站，支撑基板和堆叠的基板; 以及设置在进/出站和剥离处理站之间的运送站。 剥离处理站具有剥离堆叠的基板的剥离装置，洗涤被处理的基板的第一洗涤装置和洗涤被剥离的支撑基板的第二清洗装置。 输送站内的压力是相对于剥离装置内的压力，第一洗涤装置内的压力和第二洗涤装置内的压力的正压。 输送装置内的压力是剥离装置内的压力和第一洗涤装置内的压力的正压。
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公开(公告)号：US06814809B2
公开(公告)日：2004-11-09
申请号：US10004892
申请日：2001-12-07
IPC分类号： B05C1102
CPC分类号： H01L21/67178 , G03F7/70875 , G03F7/70991 , H01L21/67109 , H01L21/6715 , H01L21/67225 , H01L21/67778
摘要： A coating and developing apparatus has an interface section equipped with a temperature adjuster (a cooling unit). A temperature-raised substrate due to exposure on periphery of the substrate outside a circuit-forming area thereon is adjusted to a predetermined temperature by the temperature adjuster and then transferred to an exposing apparatus. The temperature adjustments before exposure provide almost the same temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, thus achieving high yields. The interface section is further provided with first and second transfer mechanisms, the first serving to transfer substrates between the processor and the exposing apparatus and the second serving to transfer substrates to each unit of a shelf section, for high transfer performance, thus achieving high throughput.
摘要翻译： 涂料和显影装置具有装配有温度调节器（冷却单元）的界面部分。 由于在其上的电路形成区域外部的衬底的周围曝光引起的升温衬底通过温度调节器调节到预定温度，然后转移到曝光装置。 曝光之前的温度调节提供了几乎相同的温度在许多衬底上转移到曝光设备，以减少曝光处理的热效应，从而实现高产量。 接口部分还设置有第一和第二传送机构，第一传送机构和第二传送机构第一传送机构用于在处理器和曝光设备之间传送基板，第二传送机构用于将基板传送到搁板部分的每个单元，以实现高传输性能，从而实现高吞吐量 。
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公开(公告)号：US20130062013A1
公开(公告)日：2013-03-14
申请号：US13609757
申请日：2012-09-11
申请人： Shinji OKADA , Masatoshi SHIRAISHI , Masatoshi DEGUCHI , Naoto YOSHITAKA , Shintaro SUGIHARA , Masataka MATSUNAGA
发明人： Shinji OKADA , Masatoshi SHIRAISHI , Masatoshi DEGUCHI , Naoto YOSHITAKA , Shintaro SUGIHARA , Masataka MATSUNAGA
IPC分类号： C09J5/06
CPC分类号： H01L21/67092 , H01L21/67109 , H01L21/67742 , H01L21/6838 , H01L21/68707
摘要： A joint apparatus that joins a processing target substrate and a supporting substrate together, includes: a processing container that is capable of hermetically closing an inside thereof; a joint unit that joins the processing target substrate and the supporting substrate together by pressing the processing target substrate and the supporting substrate via an adhesive; and a superposed substrate temperature regulation unit that temperature-regulates a superposed substrate joined in the joint unit, wherein the joint unit and the superposed substrate temperature regulation unit are arranged in the processing container, A delivery unit for delivering the processing target substrate, the supporting substrate, or the superposed substrate to/from an outside of the processing container is provided in the processing container, and the superposed substrate temperature regulation unit is provided in the delivery unit.
摘要翻译： 将加工对象基板和支撑基板连接在一起的联合装置包括：能够密封其内部的处理容器; 通过粘合剂对加工对象基板和支撑基板进行加压而将加工对象基板与支撑基板接合在一起的接合单元; 以及叠加的基板温度调节单元，其对连接在所述接合单元中的叠置基板进行温度调节，其中，所述接合单元和所述叠置基板温度调节单元配置在所述处理容器中，所述输送单元用于输送所述处理对象基板， 基板或与处理容器的外部叠置的基板设置在处理容器中，并且叠置的基板温度调节单元设置在输送单元中。
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公开(公告)号：US20130153116A1
公开(公告)日：2013-06-20
申请号：US13818356
申请日：2011-03-15
IPC分类号： H01L21/673
CPC分类号： H01L21/673 , H01L21/67092 , H01L21/6715 , H01L21/67748 , H01L21/68707 , Y10T156/10 , Y10T156/15 , Y10T156/1744
摘要： The present disclosure includes: a joint processing station including a coating unit applying an adhesive to a processing target substrate or a supporting substrate, a first heat processing unit heating the substrates coated with the adhesive, a second heat processing unit heating the substrates to a higher temperature, a reversing unit reversing front and rear surfaces of the substrate, a joint unit joining the processing target substrate and the supporting substrate together by pressing them, and a transfer region for transferring the substrates to the units; and a transfer-in/out station transferring the substrates into/from the joint processing station.
摘要翻译： 本公开内容包括：联合处理站，包括将涂布单元施加到处理目标基板或支撑基板上的涂布单元，加热涂覆有粘合剂的基板的第一热处理单元，将基板加热到更高的第二加热单元 温度反转单元，反转基板的前表面和后表面;接合单元，其通过压制将加工对象基板和支撑基板接合在一起;以及转印区域，用于将基板转印到单元; 以及将基板传送到/从联合处理站的转入/输出站。
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8.发明申请公开(公告)号：US20130146229A1
公开(公告)日：2013-06-13
申请号：US13818150
申请日：2011-03-04
IPC分类号： H01L21/02
CPC分类号： H01L21/02076 , B32B38/10 , B32B43/006 , H01L21/02057 , H01L21/67051 , H01L21/67092 , Y10T156/11 , Y10T156/1132 , Y10T156/1153 , Y10T156/1168 , Y10T156/19 , Y10T156/1911 , Y10T156/1944
摘要： The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.
摘要翻译： 本发明用于将处理对象基板和支撑基板与粘合剂接合在一起的叠加基板分离到处理对象基板和支撑基板中，并且包括：对处理对象进行预定处理的分离处理站 基板，支撑基板和叠置基板; 将基板传送到分离处理站/从分离处理站传送的输入/输出站; 以及转移单元，其在所述分离处理站和所述分离处理站之间传送所述基板，其中所述分离处理站包括：分离单元，将所述叠加的基板分离成所述处理对象基板和所述支撑基板; 清洗分离单元中分离的处理对象基板的第一清洗单元; 以及清洁在分离单元中分离的支撑基板的第二清洁单元。
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公开(公告)号：US20050042555A1
公开(公告)日：2005-02-24
申请号：US10959131
申请日：2004-10-07
IPC分类号： G03F7/16 , G03F7/20 , G03F7/30 , H01L21/00 , H01L21/027 , H01L21/677 , G03F7/00
CPC分类号： H01L21/67178 , G03F7/70875 , G03F7/70991 , H01L21/67109 , H01L21/6715 , H01L21/67225 , H01L21/67778
摘要： A coating and developing apparatus has an interface section equipped with a temperature adjuster (a cooling unit). A temperature-raised substrate due to exposure on periphery of the substrate outside a circuit-forming area thereon is adjusted to a predetermined temperature by the temperature adjuster and then transferred to an exposing apparatus. The temperature adjustments before exposure provide almost the same temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, thus achieving high yields. The interface section is further provided with first and second transfer mechanisms, the first serving to transfer substrates between the processor and the exposing apparatus and the second serving to transfer substrates to each unit of a shelf section, for high transfer performance, thus achieving high throughput.
摘要翻译： 涂料和显影装置具有装配有温度调节器（冷却单元）的界面部分。 由于在其上的电路形成区域外部的衬底的周围曝光引起的升温衬底通过温度调节器调节到预定温度，然后转移到曝光装置。 曝光之前的温度调节提供了几乎相同的温度在许多衬底上转移到曝光设备，以减少曝光处理的热效应，从而实现高产量。 接口部分还设置有第一和第二传送机构，第一传送机构和第二传送机构第一传送机构用于在处理器和曝光设备之间传送基板，第二传送机构用于将基板传送到搁板部分的每个单元，以实现高传输性能，从而实现高吞吐量 。
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公开(公告)号：US06790681B2
公开(公告)日：2004-09-14
申请号：US10173079
申请日：2002-06-18
申请人： Masataka Matsunaga , Akira Miyata , Yuichi Douki
发明人： Masataka Matsunaga , Akira Miyata , Yuichi Douki
IPC分类号： H01L2100
CPC分类号： H01L21/67748 , H01L21/67098 , H01L21/6715 , H01L21/67276 , Y10S438/905
摘要： In this invention, a time period taken with a wafer W to be transferred to the heat processing apparatus in the post exposure baking unit through the out stage in the aligner, the wafer transfer mechanism, the transition unit, the wafer transfer mechanism, and the temperature regulation and transfer apparatus in the post exposure baking unit is controlled to be approximately constant.
摘要翻译： 在本发明中，通过对准器，晶片传送机构，转移单元，晶片传送机构以及晶片传送机构中的输出级将待传送到后曝光烘焙单元中的热处理设备的晶片W所花费的时间段 后曝光烘烤单元中的温度调节和传送装置被控制为近似恒定。
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