公开(公告)号：US08217735B2

公开(公告)日：2012-07-10

申请号：US12603654

申请日：2009-10-22

申请人： Shyue-Dar Chen ,  Chih-Ming Hung

发明人： Shyue-Dar Chen ,  Chih-Ming Hung

IPC分类号： H03H7/00 ,  H03F3/213 ,  H04B1/04

CPC分类号： H01P1/20345 ,  H03F1/32 ,  H03F3/60

摘要： A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.

摘要翻译： 谐波抑制装置包括多层印刷电路板（PCB）。 多层PCB包括第一层，第二层和第三层。 第三层连接到地面。 第一层配置有功率放大器，输入微带线，分压器微带线和输出微带线。 功率放大器可用于放大使用输入微带输入的射频（RF）信号，并使用输出微带输出放大的RF信号。 第二层配置有第一微带和第二微带。 第一和第二微带中的每一个的一端通过通孔连接到第一层和第三层中的另一个，并且第一和第二微带的另一端未连接，以便抑制功率放大器上的谐波。

公开(公告)号：US20100041346A1

公开(公告)日：2010-02-18

申请号：US12332350

申请日：2008-12-11

申请人： Shyue-Dar Chen ,  Chia-Yin Liao ,  Chi-Hsin Wu

发明人： Shyue-Dar Chen ,  Chia-Yin Liao ,  Chi-Hsin Wu

IPC分类号： H04B1/40

CPC分类号： H04B1/0057

摘要： A RF circuit includes a master PCB, a plurality of slave PCBs and a plurality of antennas. The master PCB includes at least two RF ICs and at least two transceiving diplexer groups for tranceiving different frequency bands. Each transceiving diplexer group includes a plurality of transceiving diplexers transceiving a same frequency band and electrically connected to the RF ICs via PCB tracks without intersection. Each slave PCB includes a frequency division diplexer electrically connected to at least two transceiving diplexers respectively belonging to different tranceiving diplexer groups for respectively transmitting different frequency bands. Each antenna electrically connects to one of the division diplexers.

摘要翻译： RF电路包括主PCB，多个从属PCB和多个天线。 主PCB包括至少两个RF IC和至少两个收发双工器组，用于引导不同的频带。 每个收发双工器组包括多个收发相同频带的收发双工器，并且通过PCB轨迹电连接到RF IC，而无交叉。 每个从属PCB包括一个分频双工器，它分别电连接至至少两个分别传送不同频带的收发双工器组的收发双工器。 每个天线电连接到一个分离双工器。

公开(公告)号：US08064846B2

公开(公告)日：2011-11-22

申请号：US12332350

申请日：2008-12-11

申请人： Shyue-Dar Chen ,  Chia-Yin Liao ,  Chi-Hsin Wu

发明人： Shyue-Dar Chen ,  Chia-Yin Liao ,  Chi-Hsin Wu

IPC分类号： H04B1/44

CPC分类号： H04B1/0057

摘要： A RF circuit includes a master PCB, a plurality of slave PCBs and a plurality of antennas. The master PCB includes at least two RF ICs and at least two transceiving diplexer groups for tranceiving different frequency bands. Each transceiving diplexer group includes a plurality of transceiving diplexers transceiving a same frequency band and electrically connected to the RF ICs via PCB tracks without intersection. Each slave PCB includes a frequency division diplexer electrically connected to at least two transceiving diplexers respectively belonging to different tranceiving diplexer groups for respectively transmitting different frequency bands. Each antenna electrically connects to one of the division diplexers.

摘要翻译： RF电路包括主PCB，多个从属PCB和多个天线。 主PCB包括至少两个RF IC和至少两个收发双工器组，用于引导不同的频带。 每个收发双工器组包括多个收发相同频带的收发双工器，并且通过PCB轨迹电连接到RF IC，而无交叉。 每个从属PCB包括一个分频双工器，它分别电连接至至少两个分别传送不同频带的收发双工器组的收发双工器。 每个天线电连接到一个分离双工器。

公开(公告)号：US20110032052A1

公开(公告)日：2011-02-10

申请号：US12603654

申请日：2009-10-22

申请人： SHYUE-DAR CHEN ,  CHIH-MING HUNG

发明人： SHYUE-DAR CHEN ,  CHIH-MING HUNG

IPC分类号： H03H7/01

CPC分类号： H01P1/20345 ,  H03F1/32 ,  H03F3/60

摘要： A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.

摘要翻译： 谐波抑制装置包括多层印刷电路板（PCB）。 多层PCB包括第一层，第二层和第三层。 第三层连接到地面。 第一层配置有功率放大器，输入微带线，分压器微带线和输出微带线。 功率放大器可用于放大使用输入微带输入的射频（RF）信号，并使用输出微带输出放大的RF信号。 第二层配置有第一微带和第二微带。 第一和第二微带中的每一个的一端通过通孔连接到第一层和第三层中的另一个，并且第一和第二微带的另一端未连接，以便抑制功率放大器上的谐波。