公开(公告)号：US11682816B2

公开(公告)日：2023-06-20

申请号：US16940379

申请日：2020-07-27

申请人： MEDIATEK INC.

发明人： Yi-Chieh Lin ,  Shih-Chia Chiu

IPC分类号： H01P1/203 ,  H01P7/08 ,  H01F27/28 ,  H01F27/29 ,  H03H7/01 ,  H05K1/16

CPC分类号： H01P1/20345 ,  H01F27/2804 ,  H01F27/29 ,  H01P1/20327 ,  H01P1/20381 ,  H01P7/08 ,  H03H7/0138 ,  H05K1/165

摘要： A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

公开(公告)号：US20180323485A1

公开(公告)日：2018-11-08

申请号：US15584191

申请日：2017-05-02

申请人： BAE SYSTEMS Information and Electronic Systems Integration Inc.

发明人： Souleymane GNANOU ,  James M. HUGGETT

IPC分类号： H01P1/203

CPC分类号： H01P1/20345 ,  H01P7/08

摘要： LTCC coupled stripline resonator filters for use as bandpass filters are implemented with combline topology or with interdigital topology. The filter bandwidths range from about 0.3 GHz to about 4.5 GHz, or higher, depending of the manufacturing limitations with frequency operation of about 0.1 GHz to about 100 GHz. The filters have a plurality of through plated vias extending through the filters and connecting the top and bottom ground layers to form electric walls thereby reducing the coupling between the adjacent resonators.

公开(公告)号：US09871501B2

公开(公告)日：2018-01-16

申请号：US14746173

申请日：2015-06-22

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Travis A. Barbieri ,  Basim H. Noori

IPC分类号： H03H11/04 ,  H01L23/498 ,  H01L23/66 ,  H01P3/02 ,  H05K1/02 ,  H01P11/00 ,  H03F1/02 ,  H03F3/19 ,  H03H7/01 ,  H01L23/13 ,  H01L23/36 ,  H03F3/193 ,  H01P1/203

CPC分类号： H03H11/04 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/48091 ,  H01P1/20345 ,  H01P1/2039 ,  H01P3/02 ,  H01P11/001 ,  H01P11/007 ,  H01P11/008 ,  H03F1/0288 ,  H03F3/19 ,  H03F3/193 ,  H03F2200/451 ,  H03H7/0138 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0253 ,  H01L2924/00014

摘要： An RF circuit includes a first dielectric material, a signal line and a bias line over a first surface of the first dielectric material, a conductive layer over a second surface of the first dielectric material, and a second dielectric material over the conductive layer. The first and second dielectric materials have different dielectric constants. The conductive layer includes a ground plane over which the signal line is formed. A conductive material void, with which a section of the bias line is aligned, is present in the second conductive layer. The RF circuit further includes a mounting area for an RF device. First ends of the signal line and the section of the bias line are located proximate to the mounting area to enable the signal line and the bias line to be electrically coupled with one or more leads of the RF device.

公开(公告)号：US09735456B2

公开(公告)日：2017-08-15

申请号：US14783617

申请日：2014-04-14

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Yasufumi Kawai ,  Shuichi Nagai ,  Daisuke Ueda

IPC分类号： H01P5/02 ,  H01P1/201 ,  H01L23/66 ,  H01L25/065 ,  H01P7/10 ,  H01P1/203 ,  H01P7/00 ,  H02J17/00 ,  H01P5/18 ,  H01L23/498

CPC分类号： H01P1/201 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/66 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01P1/20345 ,  H01P1/20381 ,  H01P5/187 ,  H01P7/10 ,  H02J17/00 ,  H02J50/12 ,  H02J50/70 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

公开(公告)号：US20170200998A1

公开(公告)日：2017-07-13

申请号：US14990428

申请日：2016-01-07

申请人： RAYTHEON COMPANY

发明人： Bradley O. Hansen ,  Michael R. Beylor ,  Kevin W. Patrick ,  Jeremy Bart Baldwin ,  Michael D. Gordon

IPC分类号： H01P1/203

CPC分类号： H01P1/203 ,  H01P1/20345 ,  H01P1/20363 ,  H01P3/088

摘要： A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

公开(公告)号：US09628043B2

公开(公告)日：2017-04-18

申请号：US14355057

申请日：2012-10-30

申请人： EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE

发明人： Marc Meyer

IPC分类号： H03H7/09 ,  H01F27/24 ,  H01F27/28 ,  H01F19/04 ,  H01P1/203 ,  H01P1/23 ,  H01F3/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16

CPC分类号： H03H7/09 ,  H01F3/14 ,  H01F19/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2804 ,  H01P1/20345 ,  H01P1/23 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/036 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/086

摘要： An EMC filtering device comprises a printed circuit comprising at least two parallel layers of a high-permittivity material, which are positioned between two layers of an insulating material that are parallel to one another and to the high-permittivity material layers. A core made of a magnetic material comprises three cylindrical arms passing perpendicularly through the high-permittivity and insulating material layers. At least two windings winding around the first arm of the magnetic material core, the windings and the first arm forming a first coil. At least two windings winding around the second arm of the magnetic material core, the windings and the second arm forming a second coil. The two coils being coupled coils.

公开(公告)号：US09544991B2

公开(公告)日：2017-01-10

申请号：US13977537

申请日：2011-12-19

申请人： Chung-Hao J. Chen ,  Dong-Ho Han ,  Mike Schaffer

发明人： Chung-Hao J. Chen ,  Dong-Ho Han ,  Mike Schaffer

IPC分类号： H05K1/02 ,  H01P1/203 ,  H01P3/02 ,  G06F1/16 ,  H01F17/00

CPC分类号： H05K1/0237 ,  G06F1/16 ,  H01F17/0013 ,  H01F2017/0093 ,  H01P1/20327 ,  H01P1/20345 ,  H01P3/026

摘要： Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board, a second differential pair on the first layer of the printed circuit board, and a common mode filter on a second layer of the printed circuit board, the common mode filter comprising an absence of a predominantly occurring dielectric material of the printed circuit board, the common mode filter spanning an area directly below at least a portion of both the first and the second differential pairs. Other embodiments are also described and claimed.

摘要翻译： 多对差分线路印刷电路板共模滤波器一般被描述。 在一个实施例中，该装置包括多层印刷电路板，第一信号线和在印刷电路板的第一层上形成第一差分对的第二信号线，在印刷电路板的第一层上的第二差分对 电路板和在印刷电路板的第二层上的共模滤波器，所述共模滤波器包括不存在印刷电路板的主要出现的电介质材料，所述共模滤波器跨越至少部分的正下方的区域 的第一和第二差分对。 还描述和要求保护其他实施例。

公开(公告)号：US20160301376A1

公开(公告)日：2016-10-13

申请号：US14685579

申请日：2015-04-13

申请人： The Boeing Company

发明人： John D. Williams

IPC分类号： H03H1/00 ,  H04B1/50 ,  H03H2/00

CPC分类号： H04B1/50 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/0161 ,  H03H2250/00

摘要： Systems and methods according to one or more embodiments are provided for filtering of communication signals. Filtering may be implemented, for example, as a bandpass filter that is selectively tuned across a communication system frequency range to more effectively utilize the communication system bandwidth. In one example, a system includes a printed wiring board (PWB) and a filter implemented in the PWB. The filter includes first and second ports, an inductor comprising a plurality of vias extending through the PWB and a plurality of conductors connecting the plurality of vias to provide a plurality of coils between the first and second ports, and a plurality of capacitors disposed within the PWB. Additional systems and methods are also provided.

摘要翻译： 根据一个或多个实施例的系统和方法被提供用于过滤通信信号。 滤波可以例如实现为在通信系统频率范围内有选择地调谐以更有效地利用通信系统带宽的带通滤波器。 在一个示例中，系统包括印刷电路板（PWB）和实现在PWB中的滤波器。 滤波器包括第一和第二端口，包括延伸穿过PWB的多个通孔的电感器和连接多个通孔以在第一和第二端口之间提供多个线圈的多个导体以及设置在第一和第二端口内的多个电容器 工作计划和预算 还提供了附加的系统和方法。

公开(公告)号：US20160248140A1

公开(公告)日：2016-08-25

申请号：US15027370

申请日：2014-12-04

申请人： SOUTH CHINA UNIVERSITY OF TECHNOLOGY

发明人： Xiuyin Zhang ,  Xiaofeng Liu ,  Jinxu Xu ,  Xiaolan Zhao

IPC分类号： H01P5/10 ,  H01P1/203

CPC分类号： H01P5/10 ,  H01P1/203 ,  H01P1/20345

摘要： The invention presents a LTCC balun filter using two out-of-phase filtering circuits. The LTCC balun filter is comprised of three half-wavelength resonators and grounds which are located on fourteen metal layers. Vias are utilized to connect different metal parts. The first, fourth, seventh, eleventh and fourteenth metal layers are the ground. The three half-wavelength resonators are on the second, third, fifth, sixth, eighth, ninth, tenth, twelfth and thirteenth metal layers. By adjusting the coupling parts of the three half-wavelength resonators, namely the lengths of the seventh, eighth, ninth, tenth and eleventh layers, as well as the distances between them, the coupling strength between the half-wavelength resonators can be tuned. In addition, the quality factor of the circuit can be improved by tuning the port positions. By using the multi-layer LTCC technology, the present invention has the advantage of compact size, novelty, creativity and practicability.

摘要翻译： 本发明提出了一种使用两个异相滤波电路的LTCC平衡不平衡变换器。 LTCC平衡不平衡变压器由三个半波长谐振器和接地组成，位于十四个金属层。 通孔用于连接不同的金属部件。 第一，第四，第七，第十一和第十四金属层是地面。 三个半波长谐振器在第二，第三，第五，第六，第八，第九，第十，第十二，第十二和第十三金属层上。 通过调节三个半波长谐振器的耦合部分，即第七，第八，第九，第十和第十层的长度以及它们之间的距离，可以调节半波长谐振器之间的耦合强度。 此外，通过调整端口位置可以提高电路的品质因数。 通过使用多层LTCC技术，本发明具有紧凑的尺寸，新颖性，创造性和实用性的优点。

公开(公告)号：US09350062B2

公开(公告)日：2016-05-24

申请号：US14457653

申请日：2014-08-12

申请人： Anaren, Inc.

发明人： Hans P. Ostergaard ,  Michael J. Len ,  Chong Mei ,  Brian K. Buyea

IPC分类号： H01P3/08 ,  H01P11/00 ,  H01L23/498 ,  H01L23/66 ,  H01P1/203 ,  H05K1/03

CPC分类号： H01P3/081 ,  H01L23/49833 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01P1/20345 ,  H01P3/088 ,  H01P5/227 ,  H01P11/003 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/036 ,  H05K3/0061 ,  H01L2924/00

摘要： The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

摘要翻译： 本发明涉及一种RF器件，其包括具有预定的热导率的陶瓷层的叠层结构，其是预定的RF器件工作温度的函数。 陶瓷层形成层压结构的第一主表面，并且第二主要陶瓷表面被结合到热塑性材料层上，该热塑性材料层又结合到导电层。 热塑性材料具有与导电层基本一致的热膨胀系数。 第一电路布置设置在层压结构的第一主表面上，并且其包括具有预定几何形状和预定电特性的第一RF电路结构。 层压结构被配置成通过层压结构的基本上整个第二主表面消散由至少一个第一RF电路结构产生的热能。