公开(公告)号：US20080190867A1

公开(公告)日：2008-08-14

申请号：US11833234

申请日：2007-08-03

申请人： Sin Chai Lin ,  Yuan Hsin Peng ,  Jiang Liu ,  Jun Feng

发明人： Sin Chai Lin ,  Yuan Hsin Peng ,  Jiang Liu ,  Jun Feng

IPC分类号： B01D37/00 ,  B01D43/00

CPC分类号： B01D36/02 ,  B01D37/00 ,  B01D43/00 ,  C02F1/444 ,  C02F2103/346

摘要： The present invention provides a system for treating wastewater produced during grinding and slicing in a semiconductor packaging process, comprising a collecting tank for collecting the wastewater produced during grinding and/or slicing in a semiconductor packaging process; a physical filtration device for separating the suspended materials from the wastewater by physical filtration, the physical filtration device being in fluid communication with the collecting tank; a receiving device for receiving the wastewater treated by the physical filtration device, and the receiving device being in fluid communication with the physical filtration device. The present invention further provides a method for treating wastewater produce during grinding and slicing in a semiconductor packaging process. The present invention simplifies the treatment of wastewater produced during grinding and slicing in a semiconductor packaging process, and lowers the cost.

摘要翻译： 本发明提供了一种处理在半导体封装过程中研磨和切片期间产生的废水的系统，包括：用于收集在半导体封装过程中研磨和/或切片期间产生的废水的收集罐; 物理过滤装置，用于通过物理过滤将悬浮物与废水分离，物理过滤装置与收集罐流体连通; 用于接收由所述物理过滤装置处理的废水的接收装置，以及所述接收装置与所述物理过滤装置流体连通。 本发明还提供了一种在半导体封装过程中在研磨和切片期间处理废水产物的方法。 本发明简化了在半导体封装工艺中在研磨和切片期间产生的废水的处理，降低了成本。