公开(公告)号：US06852633B2

公开(公告)日：2005-02-08

申请号：US10796700

申请日：2004-03-08

申请人： Chien Hua Chen ,  Yuan Hsin Peng ,  Xiao Hua Li

发明人： Chien Hua Chen ,  Yuan Hsin Peng ,  Xiao Hua Li

IPC分类号： B24B37/04 ,  B24B55/03 ,  H01L21/306 ,  H01L21/302

CPC分类号： B24B55/03 ,  B24B37/04 ,  Y10S438/959

摘要： A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.

摘要翻译： 一种用于处理包括水循环处理的集成电路装置的方法。 该方法包括操作化学机械平面化工艺，其包括工艺用水的排放。 工艺用水用于处理一个或多个半导体晶片。 该方法还选择性地从排放物中排出工艺用水。 包括将处理水从化学机械平面化处理转移到设备过程的步骤。 然后，该方法在设施过程中使用排出的水。

公开(公告)号：US20080190867A1

公开(公告)日：2008-08-14

申请号：US11833234

申请日：2007-08-03

申请人： Sin Chai Lin ,  Yuan Hsin Peng ,  Jiang Liu ,  Jun Feng

发明人： Sin Chai Lin ,  Yuan Hsin Peng ,  Jiang Liu ,  Jun Feng

IPC分类号： B01D37/00 ,  B01D43/00

CPC分类号： B01D36/02 ,  B01D37/00 ,  B01D43/00 ,  C02F1/444 ,  C02F2103/346

摘要： The present invention provides a system for treating wastewater produced during grinding and slicing in a semiconductor packaging process, comprising a collecting tank for collecting the wastewater produced during grinding and/or slicing in a semiconductor packaging process; a physical filtration device for separating the suspended materials from the wastewater by physical filtration, the physical filtration device being in fluid communication with the collecting tank; a receiving device for receiving the wastewater treated by the physical filtration device, and the receiving device being in fluid communication with the physical filtration device. The present invention further provides a method for treating wastewater produce during grinding and slicing in a semiconductor packaging process. The present invention simplifies the treatment of wastewater produced during grinding and slicing in a semiconductor packaging process, and lowers the cost.

摘要翻译： 本发明提供了一种处理在半导体封装过程中研磨和切片期间产生的废水的系统，包括：用于收集在半导体封装过程中研磨和/或切片期间产生的废水的收集罐; 物理过滤装置，用于通过物理过滤将悬浮物与废水分离，物理过滤装置与收集罐流体连通; 用于接收由所述物理过滤装置处理的废水的接收装置，以及所述接收装置与所述物理过滤装置流体连通。 本发明还提供了一种在半导体封装过程中在研磨和切片期间处理废水产物的方法。 本发明简化了在半导体封装工艺中在研磨和切片期间产生的废水的处理，降低了成本。