公开(公告)号：US08625067B2

公开(公告)日：2014-01-07

申请号：US13380893

申请日：2011-12-05

申请人： Ming-Feng Deng ,  Yi-Zhuang Zhuang ,  Song-Xian Wen ,  Xiao-Xin Zhang ,  Shao-Yuan Zhang ,  Hao Jin

发明人： Ming-Feng Deng ,  Yi-Zhuang Zhuang ,  Song-Xian Wen ,  Xiao-Xin Zhang ,  Shao-Yuan Zhang ,  Hao Jin

IPC分类号： G02F1/1339

CPC分类号： G02F1/1339

摘要： A sealant applying apparatus for an LCD substrate is disclosed, which comprises a first sealant spraying nozzle, a second sealant spraying nozzle and a conductive medium spraying nozzle. The first sealant spraying nozzle is fixedly spaced apart from the conductive medium spraying nozzle, the first sealant spraying nozzle, the second sealant spraying nozzle and the conductive medium spraying nozzle move together, and the first sealant spraying nozzle and the second sealant spraying nozzle are opened or closed together. A sealant applying method for an LCD substrate is further disclosed. According to the present disclosure, the sealant applying apparatus for an LCD substrate and the sealant applying method for an LCD substrate allow for uniform application of a sealant, saving of the process time and saving of the material cost.

摘要翻译： 公开了一种用于LCD基板的密封剂施加装置，其包括第一密封剂喷嘴，第二密封剂喷嘴和导电介质喷射喷嘴。 第一密封剂喷嘴与导电介质喷射喷嘴固定地间隔开，第一密封剂喷嘴，第二密封剂喷嘴和导电介质喷嘴一起移动，第一密封剂喷射喷嘴和第二密封剂喷射喷嘴打开 或关闭在一起。 进一步公开了一种用于LCD基板的密封剂施加方法。 根据本公开，用于LCD基板的密封剂施加装置和用于LCD基板的密封剂施加方法允许密封剂的均匀应用，节省处理时间并节省材料成本。

公开(公告)号：US20130128214A1

公开(公告)日：2013-05-23

申请号：US13380893

申请日：2011-12-05

申请人： Ming-Feng Deng ,  Yi-Zhuang Zhuang ,  Song-Xian Wen ,  Xiao-Xin Zhang ,  Shao-Yuan Zhang ,  Hao Jin

发明人： Ming-Feng Deng ,  Yi-Zhuang Zhuang ,  Song-Xian Wen ,  Xiao-Xin Zhang ,  Shao-Yuan Zhang ,  Hao Jin

IPC分类号： G02F1/1339

CPC分类号： G02F1/1339

摘要： A sealant applying apparatus for an LCD substrate is disclosed, which comprises a first sealant spraying nozzle, a second sealant spraying nozzle and a conductive medium spraying nozzle. The first sealant spraying nozzle is fixedly spaced apart from the conductive medium spraying nozzle, the first sealant spraying nozzle, the second sealant spraying nozzle and the conductive medium spraying nozzle move together, and the first sealant spraying nozzle and the second sealant spraying nozzle are opened or closed together. A sealant applying method for an LCD substrate is further disclosed. According to the present disclosure, the sealant applying apparatus for an LCD substrate and the sealant applying method for an LCD substrate allow for uniform application of a sealant, saving of the process time and saving of the material cost.

摘要翻译： 公开了一种用于LCD基板的密封剂施加装置，其包括第一密封剂喷嘴，第二密封剂喷嘴和导电介质喷射喷嘴。 第一密封剂喷嘴与导电介质喷射喷嘴固定地间隔开，第一密封剂喷嘴，第二密封剂喷嘴和导电介质喷嘴一起移动，第一密封剂喷射喷嘴和第二密封剂喷射喷嘴打开 或关闭在一起。 进一步公开了一种用于LCD基板的密封剂施加方法。 根据本公开，用于LCD基板的密封剂施加装置和用于LCD基板的密封剂施加方法允许密封剂的均匀应用，节省处理时间并节省材料成本。

公开(公告)号：US20130140291A1

公开(公告)日：2013-06-06

申请号：US13380858

申请日：2011-12-14

申请人： Yi-Zhuang Zhuang ,  Jung-Mao Tsai ,  Shiue-Shih Liao ,  Song-Xian Wen ,  Ming--Feng Deng

发明人： Yi-Zhuang Zhuang ,  Jung-Mao Tsai ,  Shiue-Shih Liao ,  Song-Xian Wen ,  Ming--Feng Deng

IPC分类号： H05B7/18

CPC分类号： B23K26/0093 ,  B23K26/364 ,  C03B33/033 ,  C03B33/076 ,  C03B33/082

摘要： A glass substrate slicing apparatus is disclosed, which comprises a laser emitting device and a slicing device. The laser emitting device is adapted to emit a laser beam onto a surface of a glass substrate to be sliced so as to form micro-grooves on the surface of the glass substrate; and the slicing device is adapted to slice the glass substrate at locations of the micro-grooves, and comprises a wheel cutter fixing device and a diamond wheel cutter fixed on the wheel cutter fixing device. A laser beam is emitted by the laser emitting device to form micro-grooves on a surface of the glass substrate so that a diamond wheel cutter can be inserted into the micro-grooves to slice the glass substrate at locations of the micro-grooves. As a result, the frictional force between the diamond wheel cutter and the glass substrate can be enhanced to prevent slipping of the diamond wheel cutter during the slicing process, thus improving the slicing accuracy.

摘要翻译： 公开了一种玻璃基板切片装置，其包括激光发射装置和切片装置。 激光发射装置适于将激光束发射到待切割的玻璃基板的表面上，以在玻璃基板的表面上形成微槽; 并且所述切片装置适于在所述微槽的位置处切割所述玻璃基板，并且包括固定在所述轮切割器固定装置上的轮切割器固定装置和金刚石砂轮切割器。 由激光发射装置发射激光束，以在玻璃基板的表面上形成微凹槽，使金刚石砂轮切割机能够插入到微槽中，以将玻璃基板切割成微槽的位置。 结果，可以提高金刚石砂轮切割器和玻璃基板之间的摩擦力，以防止切割过程中金刚石砂轮切割器滑动，从而提高切片精度。