公开(公告)号：US20100007007A1

公开(公告)日：2010-01-14

申请号：US12496819

申请日：2009-07-02

Applicant: Sung-hwan YOON ,  Jai-kyeong Shin ,  Yong-nam Koh ,  Hyoung-suk Kim ,  In-ku Kang ,  Ho-jin Lee ,  Sang-wook Park ,  Joong-kyo Kook ,  Min-young Son ,  Soong-yong Hur

Inventor： Sung-hwan YOON ,  Jai-kyeong Shin ,  Yong-nam Koh ,  Hyoung-suk Kim ,  In-ku Kang ,  Ho-jin Lee ,  Sang-wook Park ,  Joong-kyo Kook ,  Min-young Son ,  Soong-yong Hur

IPC: H01L23/498 ,  H01L23/29

CPC classification number: H01L23/295 ,  H01L23/3171 ,  H01L23/564 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions.

Abstract translation: 半导体封装包括：具有第一表面的半导体芯片和与第一表面相对并允许在其上形成半导体器件的第二表面; 配置在半导体芯片的第二表面上的接合焊盘; 以及设置在半导体芯片的第一表面上的金属离子阻挡层，并且防止金属离子通过半导体芯片的第一表面渗入半导体芯片。 因此，半导体封装可以通过最小化吸湿和有效地阻挡金属离子的穿透而获得优良的半导体器件。