摘要:
A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer.
摘要:
A self-positioning belt roll fuser stripping apparatus and system includes an internal pressure roll entraining a fuser belt. The internal pressure engages an external pressure roll to form a fusing nip. The internal pressure roll includes an internal pressure roll bearing to which a mounting plate is attached, allowing the mounting plate to move about a rotational axis of the internal pressure roll. A strip bar is attached to the mounting plate, and configured to force the fuser belt toward the external pressure roll. A mounting plate ski is configured to contact an external pressure roll bearing to limit movement of the mounting plate, positioning the strip shoe as desired when the mounting plate is moved to guide the strip show toward the fusing nip.
摘要:
A belt-roll fuser system includes a belt-roll fuser apparatus wherein a belt is entrained about at least a first internal pressure roll and a second internal pressure roll. The first internal pressure roll and the second internal pressure roll are configured to force a belt against an external pressure roll at a fusing nip, the belt conforming to the external pressure roll across substantially a length of the fusing nip. A passive belt support may interpose internal pressure rolls for ensuring a consistent fusing pressure across the length of the nip. A pressure belt may interpose the fuser belt and the internal pressure rolls.
摘要:
A self-positioning belt roll fuser stripping apparatus and system includes an internal pressure roll entraining a fuser belt. The internal pressure engages an external pressure roll to form a fusing nip. The internal pressure roll includes an internal pressure roll bearing to which a mounting plate is attached, allowing the mounting plate to move about a rotational axis of the internal pressure roll. A strip bar is attached to the mounting plate, and configured to force the fuser belt toward the external pressure roll. A mounting plate ski is configured to contact an external pressure roll bearing to limit movement of the mounting plate, positioning the strip shoe as desired when the mounting plate is moved to guide the strip show toward the fusing nip.
摘要:
A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer.
摘要:
A predistortion arrangement is described for using an input signal to drive a nonlinear device having a drive input. Initially, first means sample a portion of the input signal. The sampled portion of the input signal is introduced to at least one predistortion path including a mixer responsive to the sampled portion of the input signal for producing at least second order intermodulation products of the input signal. The second order intermodulation products are conditioned. Combining means then combine the conditioned second order intermodulation products with the sampled input signal in a way which produces a predistorted drive signal compensated for second order distortion for use in driving the drive input of the nonlinear device. In one aspect, the sampling means and the combining means may be provided using resistive networks. The use of the resistive networks eliminates the need for directional couplers incorporating magnetic components. Accordingly, the predistortion arrangement including the mixer and the resistive networks may be provided in the form of an integrated circuit.
摘要:
A structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.
摘要:
Apparatuses useful for printing and methods for stripping media from surfaces in apparatuses useful for printing are disclosed. An apparatus useful for printing including a first member including a first outer surface; a second member including a second outer surface; a belt including an inner surface and an outer surface; a first nip formed by contact between the inner surface of the belt and the second outer surface and contact between the outer surface of the belt and the first outer surface; and a stripping mechanism including a stripping member disposed internal to the belt. The stripping member is positionable relative to the first nip to vary a pressure applied by the outer surface of the belt against the first outer surface downstream from the first nip. The media are stripped from the outer surface of the belt after exiting from the first nip.
摘要:
A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer.
摘要:
A method and apparatus for measuring nip width in an image production device is disclosed. The method may include receiving a signal to measure the nip width, the nip width being the distance of an arc length created by an intersection of the fuser roll and the pressure roll, positioning a nip width measuring device into the nip, measuring the nip width, determining if the measured nip width meets a required nip width, wherein if the measured nip width does not meet the required nip width, adjusting the nip width.