公开(公告)号：US06208517B1

公开(公告)日：2001-03-27

申请号：US09393419

申请日：1999-09-10

申请人： Stephen T. Prince ,  Toby D. Cole ,  Kevin C. Brundidge ,  Larry W. Tucker

发明人： Stephen T. Prince ,  Toby D. Cole ,  Kevin C. Brundidge ,  Larry W. Tucker

IPC分类号： H05H720

CPC分类号： H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes mounting feet, a plurality of folds, and a clip. Each of the folds has a base portion, and the clip couples at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions. An apparatus includes a printed circuit board, mounting receptacles on the printed circuit board, a heat sink, and a device package. The heat sink includes feet adapted to interface with the mounting receptacles, a plurality of folds, and a base portion defined between the folds. The device package is coupled to the printed circuit board. The base portion of the heat sink contacts at least a portion of the device package.

摘要翻译： 散热器包括安装脚，多个折叠物和夹子。 每个折叠具有基部，并且夹子将至少两个折叠部联接在一起，以在至少由相邻基部限定的接触区域中抑制扇形化。 一种装置包括印刷电路板，印刷电路板上的安装插座，散热器和装置封装。 散热器包括适于与安装插座相接合的脚，多个折叠部以及限定在折叠部之间的基部。 器件封装耦合到印刷电路板。 散热器的基部接触器件封装的至少一部分。