SOLVENTBORNE THERMOSETTING COMPOSITIONS CONTAINING COPOLYMERS OF ISOBUTYLENE TYPE MONOMERS
    1.
    发明申请
    SOLVENTBORNE THERMOSETTING COMPOSITIONS CONTAINING COPOLYMERS OF ISOBUTYLENE TYPE MONOMERS 审中-公开
    含有异丁烯类单体的共聚物的溶剂热稳定剂组合物

    公开(公告)号:US20090023862A1

    公开(公告)日:2009-01-22

    申请号:US11778820

    申请日:2007-07-17

    IPC分类号: C08F8/00 C08J3/20

    摘要: The present invention is directed to a solventborne thermosetting composition comprising:(a) a polymeric binder comprising a copolymer, said copolymer being a polymerization product of: (i) 10 to 30 percent by weight, based on the total weight of monomers used to prepare the copolymer, of a monomer having the following structure (I): wherein R1 comprises linear or branched C1 to C4 alkyl, and R2 comprises methyl, linear, cyclic or branched C1 to C20 alkyl or alkenyl; (ii) 5 to 25 percent by weight, based on the total weight of monomers used to prepare the copolymer, of a monomer having aromatic functionality; (iii) 0 to 60 percent by weight, based on the total weight of monomers used to prepare the copolymer, of an ethylenically unsaturated monomer containing secondary hydroxyl groups; and (iv) 15 to 50 percent by weight, based on the total weight of monomers used to prepare the copolymer, of an ethylenically unsaturated monomer containing primary hydroxyl groups; (b) an aminoplast curing agent; and(c) a compound comprising a capped isocyanate-functional material.

    摘要翻译: 本发明涉及一种溶剂型热固性组合物,其包含:(a)包含共聚物的聚合物粘合剂,所述共聚物是聚合产物,其聚合产物为:(i)基于用于制备的单体总重量的10至30重量% 该共聚物具有以下结构(I)的单体:其中R 1包含直链或支链C 1至C 4烷基,R 2包括甲基,直链,环状或支链C 1至C 20烷基或链烯基; (ii)基于用于制备共聚物的单体的总重量,5至25重量%的具有芳族官能团的单体; (iii)基于用于制备共聚物的单体的总重量,0至60重量%的含有仲羟基的烯属不饱和单体; 和(iv)基于用于制备共聚物的单体的总重量为15〜50重量%的含有伯羟基的烯属不饱和单体; (b)氨基塑料固化剂; 和(c)包含封端的异氰酸酯官能材料的化合物。