公开(公告)号：US08462519B2

公开(公告)日：2013-06-11

申请号：US12781307

申请日：2010-05-17

Applicant: Esen Bayar ,  Steven David Clements ,  Graham James Quintal

Inventor： Esen Bayar ,  Steven David Clements ,  Graham James Quintal

IPC: H05K9/00

CPC classification number: H05K9/0022 ,  Y10T29/49 ,  Y10T29/49826

Abstract: There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield over a first area of the circuit board and placing a second electromagnetic shield over a second area of the circuit board. At least one of the electromagnetic shields has at least one projection therefrom that contacts and makes electrical connection with a surface of the other electromagnetic shield when the shields are placed on the circuit board.

Abstract translation: 公开了一种屏蔽电路板，电路板，电磁屏蔽以及制造电磁屏蔽的方法。 一方面，该方法包括将第一电磁屏蔽物放置在电路板的第一区域上，并将第二电磁屏蔽物放置在电路板的第二区域上。 当屏蔽件被放置在电路板上时，电磁屏蔽中的至少一个具有至少一个突起，其与另一个电磁屏蔽的表面接触并形成电连接。

公开(公告)号：US20110279995A1

公开(公告)日：2011-11-17

申请号：US12781307

申请日：2010-05-17

Applicant: Esen Bayar ,  Steven David Clements ,  Graham James Quintal

Inventor： Esen Bayar ,  Steven David Clements ,  Graham James Quintal

IPC: H05K9/00 ,  B23P17/04 ,  B23P19/04

CPC classification number: H05K9/0022 ,  Y10T29/49 ,  Y10T29/49826

Abstract: There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield (10) over a first area of the circuit board (1) and placing a second electromagnetic shield (20) over a second area of the circuit board (1). At least one of the electromagnetic shields (10,20) has at least one projection (13) therefrom that contacts and makes electrical connection with a surface of the other electromagnetic shield (20,10) when the shields are placed on the circuit board (1).

Abstract translation: 公开了屏蔽电路板，电路板，电磁屏蔽以及制造电磁屏蔽的方法。 一方面，该方法包括将第一电磁屏蔽件（10）放置在电路板（1）的第一区域上，并将第二电磁屏蔽件（20）放置在电路板（1）的第二区域上。 当屏蔽件放置在电路板上时，电磁屏蔽件（10,20）中的至少一个具有至少一个突起（13），其与另一个电磁屏蔽件（20,10）的表面接触并形成电连接 1）。