公开(公告)号：US20110263134A1

公开(公告)日：2011-10-27

申请号：US12767657

申请日：2010-04-26

申请人： Steven R.A. Van Aerde ,  Rene de Blank

发明人： Steven R.A. Van Aerde ,  Rene de Blank

IPC分类号： H01L21/318 ,  H01L21/302

CPC分类号： H01L21/28556 ,  H01L21/28194 ,  H01L29/4966

摘要： In some embodiments, a reducing gas ambient containing a reducing agent is established in a batch process chamber before substrates are subjected to a deposition. The reducing atmosphere is established before and/or during loading of the substrates into the process chamber, and can include flowing reducing gas into the process chamber while the chamber is open. The reducing gas can be a mixture of a reducing agent and an inert gas, with the reducing agent being a minority component of the reducing gas. Using the reducing gas ambient, oxidation of substrate surfaces is reduced.

摘要翻译： 在一些实施方案中，在衬底经历沉积之前，在分批处理室中建立含有还原剂的还原气体环境。 还原气氛在将基材装载到处理室中之前和/或期间建立，并且可以包括在室打开时将还原气体流入处理室。 还原气体可以是还原剂和惰性气体的混合物，还原剂是还原气体的少数成分。 使用还原气体环境，基板表面的氧化降低。