Slurry for use in metal-chemical mechanical polishing and preparation method thereof
    1.
    发明申请
    Slurry for use in metal-chemical mechanical polishing and preparation method thereof 审中-公开
    用于金属化学机械抛光的浆料及其制备方法

    公开(公告)号:US20060157671A1

    公开(公告)日:2006-07-20

    申请号:US11326369

    申请日:2006-01-06

    IPC分类号: C09K13/00

    摘要: The present invention relates to a slurry for use in metal chemical-mechanical polishing (CMP) and a preparation method thereof. More particularly, the invention relates to a slurry for use in metal CMP, in which iron ions or divalent or higher valent metal ions are physico-chemically adsorbed on colloidal silica particles in the form of particles by a reduction, hydrolysis, impregnation or precipitation method, as well as a preparation method thereof. The slurry useful for metal CMP prepared according to the present invention has a uniform particle size distribution, and shows increased efficiencies as an oxidation catalyst and polishing slurry chemically adsorbed with metal particles, as compared to the prior metal CMP slurry distributed with metal ions. Also, the inventive slurry has long-term storage stability, since it does not show coagulation and precipitation phenomena even after it is stored for more than one year without a dispersant or a dispersion stabilizer. Furthermore, the prior fumed silica contains a large amount of environment-harmful substances for distribution stabilization, such as surfactants and amine compounds, whereas the inventive colloidal silica contains no environment-harmful substances as described above, and thus, is eco-friendly.

    摘要翻译: 本发明涉及一种用于金属化学机械抛光(CMP)的浆料及其制备方法。 更具体地说,本发明涉及一种用于金属CMP的浆料,其中铁离子或二价或更高价金属离子通过还原,水解,浸渍或沉淀法物理化学吸附在颗粒形式的胶体二氧化硅颗粒上 ,以及其制备方法。 与用金属离子分布的现有金属CMP浆料相比,用于根据本发明制备的金属CMP的浆料具有均匀的粒度分布,并且显示出作为氧化催化剂和与金属颗粒化学吸附的抛光浆料的效率提高。 此外,本发明的浆料具有长期的储存稳定性,因为即使在没有分散剂或分散稳定剂的情况下储存一年以上也不会出现凝结和沉淀现象。 此外,现有的热解法二氧化硅含有大量用于分布稳定化的环境有害物质,例如表面活性剂和胺化合物,而本发明的胶态二氧化硅不含有如上所述的环境有害物质,因此是环保的。