公开(公告)号：US08944304B2

公开(公告)日：2015-02-03

申请号：US13541177

申请日：2012-07-03

申请人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

发明人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

IPC分类号： C03B33/00

CPC分类号： C03B33/033 ,  Y02P40/57 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

摘要翻译： 本文公开了一种用于玻璃基板的断裂装置。 破碎装置包括连接到线性驱动器的断开杆，纵向安装在断裂杆上的多个线性衬套，每个包括外筒，纵向安装在破坏杆上的多个缓冲筒，以及一个在一个 方向并且具有预定宽度的条形。 每个缓冲筒包括产生压力的中空筒体，容纳在缸体中的活塞和连接到活塞的活塞杆。 破碎头沿断裂杆的纵向方向设置在断裂杆下方并连接到活塞杆和与玻璃基板接触的轴。

公开(公告)号：US08766135B2

公开(公告)日：2014-07-01

申请号：US13543497

申请日：2012-07-06

申请人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

发明人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

IPC分类号： C03B33/02 ,  C03B33/03 ,  C03B33/037 ,  B23K26/38 ,  C03B33/10

CPC分类号： C03B33/02 ,  B23K26/38 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B33/037 ,  C03B33/091 ,  C03B33/102 ,  G01N21/958

摘要： A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

摘要翻译： 根据本发明的玻璃基板激光切割装置包括：工作台，其具有多个真空吸收槽; 激光切割机 压力传感器，其在真空状态下抽吸玻璃基板时测量压力传感器; 计算处理单元，其将由压力传感器测量的真空压力与预定阈值压力进行比较，并确定玻璃基板是否断裂; 激光切割器，其包括沿着所述玻璃基板的切割方向移动的激光头并发射激光束; 以及光学传感器，其附接到激光头以一起移动并且被布置在发射到外部的激光束的前面的点处，以便检测玻璃基板的断裂。

公开(公告)号：US20130291593A1

公开(公告)日：2013-11-07

申请号：US13543497

申请日：2012-07-06

申请人： Hyung-sang ROH ,  Ja-Yong KOO ,  Sung Cheal KIM ,  Won-Kyu PARK ,  Chang-Ha LEE

发明人： Hyung-sang ROH ,  Ja-Yong KOO ,  Sung Cheal KIM ,  Won-Kyu PARK ,  Chang-Ha LEE

IPC分类号： C03B33/09

CPC分类号： C03B33/02 ,  B23K26/38 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B33/037 ,  C03B33/091 ,  C03B33/102 ,  G01N21/958

摘要： A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

摘要翻译： 根据本发明的玻璃基板激光切割装置包括：工作台，其具有多个真空吸收槽; 激光切割机 压力传感器，其在真空状态下抽吸玻璃基板时测量压力传感器; 计算处理单元，其将由所述压力传感器测量的真空压力与预定阈值压力进行比较，并确定所述玻璃基板是否断裂; 激光切割器，其包括沿着所述玻璃基板的切割方向移动的激光头并发射激光束; 以及光学传感器，其附接到激光头以一起移动并且被布置在发射到外部的激光束的前面的点处，以便检测玻璃基板的断裂。

公开(公告)号：US20130292444A1

公开(公告)日：2013-11-07

申请号：US13541177

申请日：2012-07-03

申请人： Hyung Sang ROH ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chnag-Ha Lee

发明人： Hyung Sang ROH ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chnag-Ha Lee

IPC分类号： C03B33/02

CPC分类号： C03B33/033 ,  Y02P40/57 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

摘要翻译： 本文公开了一种用于玻璃基板的断裂装置。 破碎装置包括连接到线性驱动器的断开杆，纵向安装在断裂杆上的多个线性衬套，每个包括外筒，纵向安装在破坏杆上的多个缓冲筒，以及在一个 方向并且具有预定宽度的条形。 每个缓冲筒包括产生压力的中空筒体，容纳在缸体中的活塞和连接到活塞的活塞杆。 破碎头沿断裂杆的纵向方向设置在断裂杆下方并连接到活塞杆和与玻璃基板接触的轴。