公开(公告)号：US20230300989A1

公开(公告)日：2023-09-21

申请号：US18046742

申请日：2022-10-14

申请人： TEMG TAI PCB MACHINERY CO., LTD.

发明人： PATRICK LU ,  CHIH WEI LU

IPC分类号： H05K3/06 ,  H05K3/00

CPC分类号： H05K3/068 ,  H05K3/002 ,  H05K2203/0195 ,  H05K2203/0165

摘要： A circuit board etching device for improving etching factor, comprising: a circuit board conveying device, which laterally conveys a circuit board; a circuit forming etching tank and a first etchant spraying unit, the first etchant spraying unit sprays a first etchant on the etching surface of the circuit board; and a circuit modification etching tank and a second etchant spraying unit, the second etchant spraying unit sprays a second etchant on the etching surface of the circuit board, and make the etching speed of the circuit modification etching tank slower than the etching speed of the circuit forming etching tank, whereby having the effect of improving the etching factor of the circuit board