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公开(公告)号：US20130032203A1
公开(公告)日：2013-02-07
申请号：US13540840
申请日：2012-07-03
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/048 , H01L31/02013 , H01L2224/48091 , H01L2924/1815 , Y02E10/50 , H01L2924/00014
摘要： A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.
摘要翻译： 公开了具有模制引线框架的太阳能电池及其制造方法。 具体地说，多个太阳能电池是由用于模具组装和组件组装的引线框带和软焊接技术制成的。 在引线接合，玻璃附着和传递模塑之后，修整和成型工艺产生具有模制引线框架的单个太阳能电池。
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2.发明授权Camera module with molded tape flip chip imager mount and method of manufacture 失效相机模块与模压胶片倒装芯片成像仪安装和制造方法公开(公告)号：US08430579B2
公开(公告)日：2013-04-30
申请号：US12930606
申请日：2011-01-11
IPC分类号： G03B17/00
CPC分类号： G03B17/02 , G03B17/12 , H01L27/14618 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.
摘要翻译： 公开了一种用于制造相机模块的新型设计和方法。 相机模块包括柔性电路基板，安装到柔性电路基板的底表面的图像捕获装置倒装芯片，安装在柔性电路基板的顶表面上的外壳以及耦合到外壳的透镜单元。 在示例性实施例中，相机模块包括直接形成在安装在柔性电路基板的顶表面上的多个电气部件上的加强件。 在另一示例性实施例中，柔性电路基板的底表面限定了图像捕获装置倒装芯片安装的凹部。 所公开的用于制造相机模块的方法包括提供具有多个离散电路区域的柔性电路带，提供多个图像捕获装置，将每个图像捕获装置倒装芯片安装在分立电路区域的相关联的一个上，提供多个 的壳体，并且将每个壳体安装在离散电路区域的相关联的一个上。
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3.发明申请Camera module with molded tape flip chip imager mount and method of manufacture 失效相机模块与模压胶片倒装芯片成像仪安装和制造方法公开(公告)号：US20110194023A1
公开(公告)日：2011-08-11
申请号：US12930606
申请日：2011-01-11
IPC分类号： H04N5/225
CPC分类号： G03B17/02 , G03B17/12 , H01L27/14618 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.
摘要翻译： 公开了一种用于制造相机模块的新型设计和方法。 相机模块包括柔性电路基板，安装到柔性电路基板的底表面的图像捕获装置倒装芯片，安装在柔性电路基板的顶表面上的外壳以及耦合到外壳的透镜单元。 在示例性实施例中，相机模块包括直接形成在安装在柔性电路基板的顶表面上的多个电气部件上的加强件。 在另一示例性实施例中，柔性电路基板的底表面限定了图像捕获装置倒装芯片安装的凹部。 所公开的用于制造相机模块的方法包括提供具有多个离散电路区域的柔性电路带，提供多个图像捕获装置，将每个图像捕获装置倒装芯片安装在分立电路区域的相关联的一个上，提供多个 的壳体，并且将每个壳体安装在离散电路区域的相关联的一个上。
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