公开(公告)号：US08092102B2

公开(公告)日：2012-01-10

申请号：US11444277

申请日：2006-05-31

申请人： Dongkai Shangguan ,  Samuel Waising Tam

发明人： Dongkai Shangguan ,  Samuel Waising Tam

IPC分类号： G03B17/00

CPC分类号： G03B17/02 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49175 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00014

摘要： A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

摘要翻译： 一种新颖的数字照相机模块包括图像捕获装置，电路基板，透镜单元和在图像捕获装置安装到电路基板之前安装到电路基板的壳体。 在一个具体实施例中，壳体通过模制形成在电路基板上。 壳体包括用于接收透镜单元的孔，孔的直径大于图像捕获装置的对角线，使得图像捕获装置可以通过孔安装到电路基板。 在另一特定实施例中，电路基板包括孔，以便于图像捕获装置的倒装芯片接合。 图像捕获装置和壳体耦合到电路基板的顺序有助于防止在将壳体安装到电路基板期间损坏图像捕获装置。

公开(公告)号：US20110299848A1

公开(公告)日：2011-12-08

申请号：US13214696

申请日：2011-08-22

申请人： Dongkai Shangguan ,  Samuel Waising Tam

发明人： Dongkai Shangguan ,  Samuel Waising Tam

IPC分类号： G03B17/00 ,  H05K13/00

CPC分类号： G03B17/02 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49175 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00014

摘要： A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

摘要翻译： 一种新颖的数字照相机模块包括图像捕获装置，电路基板，透镜单元和在图像捕获装置安装到电路基板之前安装到电路基板的壳体。 在一个具体实施例中，壳体通过模制形成在电路基板上。 壳体包括用于接收透镜单元的孔，孔的直径大于图像捕获装置的对角线，使得图像捕获装置可以通过孔安装到电路基板。 在另一特定实施例中，电路基板包括孔，以便于图像捕获装置的倒装芯片接合。 图像捕获装置和壳体耦合到电路基板的顺序有助于防止在将壳体安装到电路基板期间损坏图像捕获装置。

公开(公告)号：US07872686B2

公开(公告)日：2011-01-18

申请号：US10784102

申请日：2004-02-20

申请人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

发明人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

IPC分类号： H04N5/225 ,  H01L23/02 ,  H01L21/00

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

公开(公告)号：US20080170141A1

公开(公告)日：2008-07-17

申请号：US11652405

申请日：2007-01-11

申请人： Samuel Waising Tam ,  Dongkai Shangguan

发明人： Samuel Waising Tam ,  Dongkai Shangguan

IPC分类号： H04N5/335

CPC分类号： H04N5/2251 ,  H04N5/2257

摘要： An image-capture-device/processor package includes a flexible circuit substrate, an image capture device mounted on the flexible circuit substrate, a second device (e.g., processor) mounted on the flexible substrate, and a stiffener for at least partially supporting the second device. The ICD and the second device may be flip-chip mounted to the same surface of the flexible circuit substrate. The flexible circuit substrate may be folded so that the ICD is positioned back-to-back with the second device. The flexible circuit substrate may further include Land Grid Array (LGA) pads formed thereon to facilitate electrical connection with a host device.

摘要翻译： 图像捕获装置/处理器封装包括柔性电路基板，安装在柔性电路基板上的图像捕获装置，安装在柔性基板上的第二装置（例如，处理器）和用于至少部分地支撑第二 设备。 ICD和第二器件可以倒装芯片安装到柔性电路基板的相同表面上。 柔性电路基板可以被折叠，使得ICD与第二装置背对背地定位。 柔性电路基板还可以包括形成在其上的陆地栅格阵列（LGA）焊盘，以便于与主机设备的电连接。

公开(公告)号：US09178093B2

公开(公告)日：2015-11-03

申请号：US13540840

申请日：2012-07-03

申请人： Samuel Waising Tam ,  Tai Wai Pun ,  Tak Shing Pang

发明人： Samuel Waising Tam ,  Tai Wai Pun ,  Tak Shing Pang

IPC分类号： H01L31/00 ,  H01L31/048 ,  H01L31/02

CPC分类号： H01L31/048 ,  H01L31/02013 ,  H01L2224/48091 ,  H01L2924/1815 ,  Y02E10/50 ,  H01L2924/00014

摘要： A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.

摘要翻译： 公开了具有模制引线框架的太阳能电池及其制造方法。 具体地说，多个太阳能电池是由用于模具组装和组件组装的引线框带和软焊接技术制成的。 在引线接合，玻璃附着和传递模塑之后，修整和成型工艺产生具有模制引线框架的单个太阳能电池。

公开(公告)号：US08477239B2

公开(公告)日：2013-07-02

申请号：US12930822

申请日：2011-01-18

申请人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

发明人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

IPC分类号： H04N5/225 ,  H01L23/02 ,  H01L21/00

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成照相机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。

公开(公告)号：US07796187B2

公开(公告)日：2010-09-14

申请号：US11247993

申请日：2005-10-11

申请人： Dongkai Shangguan ,  Vidyadhar Sitaram Kale ,  Samuel Waising Tam

发明人： Dongkai Shangguan ,  Vidyadhar Sitaram Kale ,  Samuel Waising Tam

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成相机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。 在特定实施例中，透镜保持器（306,506）在它们彼此分离之前或之后完全形成在相机芯片（302,502）上。

公开(公告)号：US09419032B2

公开(公告)日：2016-08-16

申请号：US12583193

申请日：2009-08-14

申请人： Harpuneet Singh ,  Dongkai Shangguan ,  Samuel Waising Tam

发明人： Harpuneet Singh ,  Dongkai Shangguan ,  Samuel Waising Tam

IPC分类号： H01L27/146 ,  G02B13/00 ,  H04N5/225 ,  H05K3/34

CPC分类号： H01L27/14618 ,  G02B13/0085 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K3/3436 ,  Y10T29/49826 ,  H01L2924/00

摘要： A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies. The alternative method further includes separating the housing substrate in to a first portion formed over the first optical assembly and second portion formed over the second optical assembly, providing a second housing substrate, and forming the second housing substrate over the first and second portions.

摘要翻译： 所公开的制造相机模块的方法包括提供光学组件，提供集成电路图像捕获装置（ICD），将光学组件直接固定到ICD，然后在光学组件上直接形成壳体。 该方法还包括通过传递模塑将ICD和光学组件形成壳体。 该方法还包括在ICD的后表面上形成焊球，以使照相机模块能够回流焊接到主机设备。 在本发明的替代实施例中，该方法包括提供第二ICD，提供第二光学组件，提供外壳基板，将第一光学组件固定在第一ICD上，将第二光学组件固定在第二ICD上，以及形成 所述壳体基板在所述第一和第二光学组件上。 替代方法还包括将壳体基板分离成形成在第一光学组件上的第一部分和形成在第二光学组件上的第二部分，提供第二壳体基板，以及在第一和第二部分上形成第二壳体基板。

公开(公告)号：US08430579B2

公开(公告)日：2013-04-30

申请号：US12930606

申请日：2011-01-11

申请人： Samuel Waising Tam ,  Tai Wai (David) Pun ,  Tak Shing (Dick) Pang

发明人： Samuel Waising Tam ,  Tai Wai (David) Pun ,  Tak Shing (Dick) Pang

IPC分类号： G03B17/00

CPC分类号： G03B17/02 ,  G03B17/12 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

摘要： A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.

摘要翻译： 公开了一种用于制造相机模块的新型设计和方法。 相机模块包括柔性电路基板，安装到柔性电路基板的底表面的图像捕获装置倒装芯片，安装在柔性电路基板的顶表面上的外壳以及耦合到外壳的透镜单元。 在示例性实施例中，相机模块包括直接形成在安装在柔性电路基板的顶表面上的多个电气部件上的加强件。 在另一示例性实施例中，柔性电路基板的底表面限定了图像捕获装置倒装芯片安装的凹部。 所公开的用于制造相机模块的方法包括提供具有多个离散电路区域的柔性电路带，提供多个图像捕获装置，将每个图像捕获装置倒装芯片安装在分立电路区域的相关联的一个上，提供多个 的壳体，并且将每个壳体安装在离散电路区域的相关联的一个上。

公开(公告)号：US20110194023A1

公开(公告)日：2011-08-11

申请号：US12930606

申请日：2011-01-11

申请人： Samuel Waising Tam ,  Tai Wai (David) Pun ,  Tak Shing (Dick) Pang

发明人： Samuel Waising Tam ,  Tai Wai (David) Pun ,  Tak Shing (Dick) Pang

IPC分类号： H04N5/225

CPC分类号： G03B17/02 ,  G03B17/12 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

摘要： A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions.

摘要翻译： 公开了一种用于制造相机模块的新型设计和方法。 相机模块包括柔性电路基板，安装到柔性电路基板的底表面的图像捕获装置倒装芯片，安装在柔性电路基板的顶表面上的外壳以及耦合到外壳的透镜单元。 在示例性实施例中，相机模块包括直接形成在安装在柔性电路基板的顶表面上的多个电气部件上的加强件。 在另一示例性实施例中，柔性电路基板的底表面限定了图像捕获装置倒装芯片安装的凹部。 所公开的用于制造相机模块的方法包括提供具有多个离散电路区域的柔性电路带，提供多个图像捕获装置，将每个图像捕获装置倒装芯片安装在分立电路区域的相关联的一个上，提供多个 的壳体，并且将每个壳体安装在离散电路区域的相关联的一个上。