公开(公告)号：US4935305A

公开(公告)日：1990-06-19

申请号：US284697

申请日：1988-12-15

Applicant: Takashi Kanehiro

Inventor： Takashi Kanehiro

IPC: H01G4/12 ,  C23C18/50 ,  H01C7/00 ,  H01C17/18 ,  H01G4/008

CPC classification number: H01G4/008 ,  C23C18/50 ,  H01C7/003 ,  Y10S204/13 ,  Y10S428/901 ,  Y10T428/31678

Abstract: This invention relates to a method of forming a plating layer on ceramic chip surfaces by electroless plating, and to electronic parts manufactured by this method. Such electronic parts include a metal film fixed resistor, a capacitor, a resistor for sensing purposes and a patterned substrate, for example. Ceramic chips are immersed in a plating solution containing chromium chloride, nickel sulfide, sodium hypophosphite, a chelating agent and thiourea. Then each ceramic chip is coated with a plating layer by electroless nickel plating while adjusting pH value of the plating solution with a pH regulating liquid. The resulting electronic parts have an initial resistance of 0.02 to 100 ohm or more and a temperature coefficient of resistance of a two-digit figure or less in ppm.

Abstract translation: 本发明涉及通过化学镀在陶瓷芯片表面上形成镀层的方法以及通过该方法制造的电子部件。 这样的电子部件例如包括金属膜固定电阻器，电容器，用于感测目的的电阻器和图案化衬底。 将陶瓷屑浸入含有氯化铬，硫化镍，次磷酸钠，螯合剂和硫脲的镀液中。 然后通过化学镀镍在每个陶瓷芯片上涂覆镀层，同时用pH调节液体调节镀液的pH值。 所得到的电子部件的初始电阻为0.02〜100欧姆以上，电阻温度系数为2位数以下（ppm）。

公开(公告)号：US4822468A

公开(公告)日：1989-04-18

申请号：US205742

申请日：1988-06-13

Applicant: Takashi Kanehiro

Inventor： Takashi Kanehiro

IPC: C25D7/00 ,  C25D17/20 ,  H05K3/24

CPC classification number: C25D17/20 ,  H05K3/241

Abstract: A barrel plating apparatus for forming, by electroplating or electroless plating, a layer on surfaces of articles formed of ceramics such as zirconia for use as resistors, condensors or other electrical parts or elements mounted on printed circuit boards, for example. The apparatus comprises a hollow barrel rotatably supported by a pair of vertical plates spaced apart from each other, and unrotatable agitators housed in the barrel and including a plurality of agitating balls for agitating the articles under plating treatment. The barrel in rotation and the agitating balls produce a combined effect for agitating the articles to the full. The articles are thus plated with coatings of uniform thickness and reliable adhesion.

Abstract translation: 一种用于通过电镀或无电镀形成由诸如氧化锆的陶瓷形成的制品的表面上的层的滚镀装置，例如用作电阻器，冷凝器或安装在印刷电路板上的其它电气部件或元件。 该装置包括可旋转地由彼此间隔开的一对垂直板支撑的中空筒，以及容纳在筒体中的不可旋转搅拌器，并且包括用于在电镀处理下搅拌物品的多个搅拌球。 旋转桶和搅拌球产生用于搅拌物品的完整的组合效果。 因此，制品镀有均匀厚度和可靠粘合的涂层。