公开(公告)号：US20120285005A1

公开(公告)日：2012-11-15

申请号：US13519445

申请日：2009-12-28

申请人： Takeyuki Sato ,  Manabu Ninomiya ,  Hiroaki Yabuta ,  Takeshi Watanabe ,  Tomoyasu Nakano

发明人： Takeyuki Sato ,  Manabu Ninomiya ,  Hiroaki Yabuta ,  Takeshi Watanabe ,  Tomoyasu Nakano

IPC分类号： B23P19/00

CPC分类号： B21B31/106 ,  B21B31/08 ,  B21D5/12 ,  B23Q3/157 ,  Y10T29/53

摘要： In a forming apparatus, inner frames are arranged in a forming roll stand so as to move up and down. Mechanical structures of convexo-concave engagement are provided on opposed faces between respective roll chocks and yokes and the inner frames. After connection with a pressing device is released, the roll chocks and yokes are guided utilizing the moving-downward motion of the inner frames, and a stack body is formed in series so as to be withdrawn from the roll stand. The stack body is disassembled utilizing the moving-upward motion of the inner frames, and the roll chocks and yokes can be guided to the desired positions inside the stand and locked.

摘要翻译： 在成形装置中，内框架布置在成型辊架中以便上下移动。 在相应的辊轴承座和轭架和内框架之间的相对面上设置有凸凹接合的机械结构。 在与挤压装置的连接被释放之后，利用内框架的向下运动来引导辊轴承座和轭架，并且将堆叠体串联地形成为从辊架上取出。 利用内框架的向上运动来拆卸堆叠体，并且可以将辊轴承座和轭架引导到支架内的期望位置并锁定。

公开(公告)号：US09259772B2

公开(公告)日：2016-02-16

申请号：US13519445

申请日：2009-12-28

申请人： Takeyuki Sato ,  Manabu Ninomiya ,  Hiroaki Yabuta ,  Takeshi Watanabe ,  Tomoyasu Nakano

发明人： Takeyuki Sato ,  Manabu Ninomiya ,  Hiroaki Yabuta ,  Takeshi Watanabe ,  Tomoyasu Nakano

IPC分类号： B21B31/10 ,  B21B31/08 ,  B23Q3/157 ,  B21D5/12

CPC分类号： B21B31/106 ,  B21B31/08 ,  B21D5/12 ,  B23Q3/157 ,  Y10T29/53

摘要： In a forming apparatus, inner frames are arranged in a forming roll stand so as to move up and down. Mechanical structures of convexo-concave engagement are provided on opposed faces between respective roll chocks and yokes and the inner frames. After connection with a pressing device is released, the roll chocks and yokes are guided utilizing the moving-downward motion of the inner frames, and a stack body is formed in series so as to be withdrawn from the roll stand. The stack body is disassembled utilizing the moving-upward motion of the inner frames, and the roll chocks and yokes can be guided to the desired positions inside the stand and locked.

摘要翻译： 在成形装置中，内框架布置在成型辊架中以便上下移动。 在相应的辊轴承座和轭架和内框架之间的相对面上设置有凸凹接合的机械结构。 在与挤压装置的连接被释放之后，利用内框架的向下运动来引导辊轴承座和轭架，并且将堆叠体串联地形成为从辊架上取出。 利用内框架的向上运动来拆卸堆叠体，并且可以将辊轴承座和轭架引导到支架内的期望位置并锁定。

公开(公告)号：US06726533B2

公开(公告)日：2004-04-27

申请号：US09994820

申请日：2001-11-28

申请人： Takeyuki Sato

发明人： Takeyuki Sato

IPC分类号： H01L2350

CPC分类号： B24B29/005 ,  B24B29/02 ,  H01L21/4835 ,  Y10T29/49121

摘要： In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.

摘要翻译： 在半导体封装的引线的研磨方法中，以一定的方式配置多个半导体封装。 然后，引线自动抛光。 可以对半导体封装进行掩模以暴露待抛光的至少一部分引线。

公开(公告)号：US06336848B1

公开(公告)日：2002-01-08

申请号：US09120134

申请日：1998-07-22

申请人： Takeyuki Sato

发明人： Takeyuki Sato

IPC分类号： H01L2100

CPC分类号： B24B29/005 ,  B24B29/02 ,  H01L21/4835 ,  Y10T29/49121

摘要： An apparatus for polishing leads of a semiconductor package includes a package holder unit on which a plurality of semiconductor packages are arranged; and a polishing member that automatically polished the leads of the semiconductor package on the package holder unit. A mask may be used to cover the plurality of semiconductor packages to expose at least a part of the leads to the polishing member.

摘要翻译： 一种用于研磨半导体封装的引线的装置，包括：一个封装保持单元，多个半导体封装布置在该封装支架单元上; 以及抛光构件，其自动抛光所述封装保持器单元上的半导体封装的引线。 可以使用掩模来覆盖多个半导体封装以将至少一部分引线暴露于抛光构件。