Substrate processing method
    1.
    发明申请
    Substrate processing method 审中-公开
    基板加工方法

    公开(公告)号:US20060231124A1

    公开(公告)日:2006-10-19

    申请号:US11433616

    申请日:2006-05-15

    IPC分类号: B08B3/00

    摘要: Provided is a processing method capable of reliably processing the inside of a depression such as a trench, a contact hole, a deep pattern, or a pore of a porous substrate. A chemical solution M is supplied into a processing bath 1 placing a substrate W, and the processing bath 1 is repetitively evacuated and pressurized several times at a pressure lower than the atmospheric pressure. Alcohol X is brought into contact with the surface of the substrate W and supplied into a depression W−1. The chemical solution M is supplied into the processing bath 1 containing the substrate W until the chemical solution M reaches a water level at which the substrate W is dipped, thereby allowing the chemical solution M to enter the depression W−1. The chemical solution M is discharged from the processing bath 1, and a portion of the chemical solution M entering the depression W−1 and mixed with the alcohol X is evaporated by evacuating the processing bath 1. This process is repeated several times.

    摘要翻译: 提供了能够可靠地处理诸如沟槽,接触孔,深图案或多孔基材的孔的凹陷的内部的处理方法。 将化学溶液M供给到放置基板W的处理槽1中,并且处理槽1在低于大气压的压力下重复抽真空并加压数次。 使酒精X与基板W的表面接触并供给到凹部W-1中。 将化学溶液M供给到含有基板W的处理槽1中,直到化学溶液M达到浸渍基板W的水位,从而使化学溶液M进入凹部W-1。 从处理槽1排出化学溶液M,通过抽出处理槽1蒸发进入凹部W-1并与醇X混合的部分化学溶液M. 这个过程重复几次。

    Draining and drying apparatus of semiconductor materials
    2.
    发明授权
    Draining and drying apparatus of semiconductor materials 失效
    半导体材料的排水和干燥设备

    公开(公告)号:US5469634A

    公开(公告)日:1995-11-28

    申请号:US140523

    申请日:1993-10-25

    申请人: Tamotsu Mezaki

    发明人: Tamotsu Mezaki

    CPC分类号: H01L21/67034 F26B5/08

    摘要: A draining and drying apparatus of semiconductor materials capable of adjusting the rotation balance of a rotor for holding the semiconductor materials without requiring any filling works of dummy semiconductor materials. In a rotary casing, a rotor horizontal moving mechanism is mounted on a rotation main shaft of a rotor, and the rotor is mounted on this rotor horizontal moving mechanism, and the rotor is mechanically moved horizontally in the intersecting direction to the rotation main shaft by the rotor horizontal moving mechanism, so that the rotation balance of the rotor may be adjusted.

    摘要翻译: 能够调整用于保持半导体材料的转子的旋转平衡的半导体材料的排干和干燥装置,而不需要任何虚拟半导体材料的填充工作。 在旋转壳体中,转子水平移动机构安装在转子的旋转主轴上,转子安装在该转子水平移动机构上,转子通过与旋转主轴的交叉方向水平地机械移动 转子水平移动机构,从而可以调整转子的旋转平衡。