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公开(公告)号:US4687633A
公开(公告)日:1987-08-18
申请号:US816897
申请日:1986-01-07
申请人: Motohisa Miyafuji , Tateo Yuchi , Riichi Tsuno
发明人: Motohisa Miyafuji , Tateo Yuchi , Riichi Tsuno
IPC分类号: C22C9/06 , H01L23/495 , C22C9/04
CPC分类号: H01L23/49579 , C22C9/06 , H01L2924/0002
摘要: A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.
摘要翻译: 一种用于陶瓷封装IC的铅材料,其包含Ni 1.0-5.0重量%,Co 0.2-1.0重量%,Si 0.2-1.5重量%,Zn 0.1-5.0重量%,Cr 0.001-0.1重量%和Mn 0.02-1.0重量% %,其余为Cu和不可避免的杂质。 即使其热膨胀系数与陶瓷的热膨胀系数不同,在800〜950℃的银焊接后的冷却工序中也不会对陶瓷基板产生开裂。 此外,它在钎焊后保持其高强度和导电性。