公开(公告)号：US6136104A

公开(公告)日：2000-10-24

申请号：US348290

申请日：1999-07-07

申请人： Motohisa Miyafuji ,  Hirofumi Arai ,  Koya Nomura

发明人： Motohisa Miyafuji ,  Hirofumi Arai ,  Koya Nomura

IPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04

CPC分类号： C22C9/02 ,  C22C9/04

摘要： A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

摘要翻译： 适合用作端子和连接器的铜合金，其包含0.1重量％至小于0.5重量％的Ni，大于1.0重量％至小于2.5重量％的Sn，大于1.0重量％至大于1.0重量％ 15重量％的Zn，还包含从0.0001重量％至小于0.05重量％的P和0.0001重量％至0.005重量％的Si中选择的至少一种元素，余量为Cu和不可避免的杂质合金 相对于退火铜合金的最大导电率为90％以下的电导率，不溶物例如析出物的面积比为5％以下。

公开(公告)号：US5527377A

公开(公告)日：1996-06-18

申请号：US354848

申请日：1994-12-09

申请人： Yosuke Miwa ,  Junichi Ohsako ,  Motohisa Miyafuji ,  Isao Hosokawa ,  Syuhei Mori

发明人： Yosuke Miwa ,  Junichi Ohsako ,  Motohisa Miyafuji ,  Isao Hosokawa ,  Syuhei Mori

IPC分类号： G01R27/02 ,  G01N27/02 ,  G01N27/04 ,  G01N27/90 ,  G01N33/20 ,  C22B9/16

CPC分类号： G01N27/041 ,  G01N27/023 ,  G01N33/20

摘要： Conductivity distribution on the cross section of metal or alloy is measured by an eddy current type conductivity meter and conductivity distribution contour map is prepared. Based on the pattern of this conductivity distribution contour map, heat history of an ingot and segregation of added element are analyzed and melting and/or casting conditions of metal or alloy are re-established. This method allows to carry out the testing and analysis within short time and quickly provides assessment results for re-establishment of melting and/or casting conditions. Thereby, metal or alloy ingots which may create poor quality products during the following steps can be eliminated; in particular, applying this method to a manufacturing of copper precipitation hardening alloy and the like, more sound ingots can be obtained and suitability of ingots for the material which should be worked in the following step can be assessed.

摘要翻译： 通过涡电流型电导率仪测量金属或合金截面的电导率分布，制备电导率分布等值线图。 基于该导电率分布轮廓图的图案，分析锭的热历史和添加元素的偏析，并重新建立金属或合金的熔融和/或铸造条件。 该方法允许在短时间内进行测试和分析，并快速提供重新建立熔化和/或浇铸条件的评估结果。 因此，可以消除在以下步骤中可能产生质量差的产品的金属或合金锭; 特别是将该方法应用于铜沉淀硬化合金等的制造中，可以获得更健全的锭，并且可以评估在后续步骤中应该加工的材料的锭的适用性。

公开(公告)号：US4990309A

公开(公告)日：1991-02-05

申请号：US375936

申请日：1989-07-06

申请人： Motohisa Miyafuji ,  Riichi Tsuno ,  Tatsuya Kinoshita ,  Hitoshi Tanaka

发明人： Motohisa Miyafuji ,  Riichi Tsuno ,  Tatsuya Kinoshita ,  Hitoshi Tanaka

IPC分类号： C22C9/06

CPC分类号： C22C9/06

摘要： A high strength copper alloy of excellent bending processability containing Ni: 5-20 wt %, Sn: 0.5-3 wt %, Al: 0.5-5 wt %, Mg: 0.001-0.05 wt %, Cr: 0.001-0.1 wt %, Zn: 0.05-5 wt %, the balance of Cu and inevitable impurities, and having a tensile strength of from 80 to 120 kgf/mm.sup.2. Up to 0.2 wt % of one or more of Fe,Mn,Ti,Zr,P,In,Ta and Co can be added without a deleterious effect. The alloy is non-toxic and economical, as well as shows tensile strength and elongation at least comparable with beryllium-copper alloy and has excellent solderability and solder-resistant and heat resistant peelability. The alloy can be used suitably as materials for electric terminals, connectors, etc.

摘要翻译： 含有Ni：5-20重量％，Sn：0.5-3重量％，Al：0.5-5重量％，Mg：0.001-0.05重量％，Cr：0.001-0.1重量％的优异弯曲加工性的高强度铜合金， Zn：0.05-5wt％，余量为Cu和不可避免的杂质，拉伸强度为80〜120kgf / mm2。 Fe，Mn，Ti，Zr，P，In，Ta和Co中的一种或多种中的至多0.2重量％可以加入而没有有害影响。 该合金是无毒和经济的，并且显示出与铍铜合金至少相当的拉伸强度和伸长率，并且具有优异的可焊性和耐焊接和耐热剥离性。 该合金可以适当地用作电端子，连接器等的材料。

公开(公告)号：US5769129A

公开(公告)日：1998-06-23

申请号：US737341

申请日：1997-02-10

申请人： Taro Kuroda ,  Motohisa Miyafuji ,  Kenju Minamoto

发明人： Taro Kuroda ,  Motohisa Miyafuji ,  Kenju Minamoto

IPC分类号： F16L58/08 ,  F28F19/06 ,  F28F21/08 ,  F16L9/14

CPC分类号： F16L58/08 ,  F28F19/06

摘要： A cold- and hot-water supply copper alloy pipe with an inner-surface protective film is provided. A pipe body is made of a copper alloy which consists essentially of at least one of Zn and Mn by 0.02 wt % or more as the total amount, Zn being restricted to 5 wt % or less and Mn being restricted to 3 wt % or less and balance being copper and inevitable impurities. A protective film is formed on the inner surface of the copper alloy pipe body and made of Sn and inevitable impurities. The protective film has an average thickness of 0.2 to 4 .mu.m in the pipe circumferential direction. The protective film can be made of Sn, an intermetallic compound of Sn and Cu, and inevitable impurities or made of an intermetallic compound of Sn an Cu and inevitable impurities. In any case, Cu.sub.3 Sn must not present on the surface of the protective film. This type of copper alloy pipe makes it possible to prevent an .epsilon. phase which causes pitting from forming on the surface of the protective film, prevent copper ions from being eluted, and improve the pitting resistance.

摘要翻译： PCT No.PCT / JP95 / 00447 Sec。 371日期1997年2月10日 102（e）日期1997年2月10日PCT 1995年3月16日PCT公布。 WO96 / 28686 PCT公开号 日期1996年9月19日提供具有内表面保护膜的冷热水供应铜合金管。 管体由铜合金制成，其主要由Zn和Mn中的至少一种组成，总量为0.02重量％以上，Zn为5重量％以下，Mn为3重量％以下 其余为铜和不可避免的杂质。 在铜合金管体的内表面上形成有由Sn和不可避免的杂质构成的保护膜。 保护膜在管周方向上的平均厚度为0.2〜4μm。 保护膜可以由Sn，Sn和Cu的金属间化合物和不可避免的杂质制成，或者由Sn和Cu的金属间化合物和不可避免的杂质制成。 在任何情况下，Cu3Sn不能存在于保护膜的表面上。 这种铜合金管使得可以防止在保护膜的表面上形成点蚀的ε相，防止铜离子被洗脱，并且提高耐点蚀性。

公开(公告)号：US4687633A

公开(公告)日：1987-08-18

申请号：US816897

申请日：1986-01-07

申请人： Motohisa Miyafuji ,  Tateo Yuchi ,  Riichi Tsuno

发明人： Motohisa Miyafuji ,  Tateo Yuchi ,  Riichi Tsuno

IPC分类号： C22C9/06 ,  H01L23/495 ,  C22C9/04

CPC分类号： H01L23/49579 ,  C22C9/06 ,  H01L2924/0002

摘要： A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.

摘要翻译： 一种用于陶瓷封装IC的铅材料，其包含Ni 1.0-5.0重量％，Co 0.2-1.0重量％，Si 0.2-1.5重量％，Zn 0.1-5.0重量％，Cr 0.001-0.1重量％和Mn 0.02-1.0重量％ ％，其余为Cu和不可避免的杂质。 即使其热膨胀系数与陶瓷的热膨胀系数不同，在800〜950℃的银焊接后的冷却工序中也不会对陶瓷基板产生开裂。 此外，它在钎焊后保持其高强度和导电性。

公开(公告)号：US06202703B1

公开(公告)日：2001-03-20

申请号：US08250607

申请日：1994-05-27

申请人： Taro Kuroda ,  Motohisa Miyafuji ,  Kenju Minamoto ,  Mitsuhiro Ohkubo ,  Ryoichi Ozaki ,  Akinori Tsuchiya

发明人： Taro Kuroda ,  Motohisa Miyafuji ,  Kenju Minamoto ,  Mitsuhiro Ohkubo ,  Ryoichi Ozaki ,  Akinori Tsuchiya

IPC分类号： F16L902

CPC分类号： F28F21/085 ,  C22C9/05 ,  F28F19/06

摘要： The copper alloy tube disclosed here contains 0.05 to 1.5 wt. % of Mn and deoxidized copper containing oxygen concentration at 100 ppm or less. At least one element selected from a group of elements comprising P, B, Li, Pb and Sb can be added at the amount of 0.20 wt. % or less in total. At least one element selected from another group of elements comprising Cr, Ti, Zr, Al and Si also can be added at the amount of 0.50 wt. % or less in total. Further, at least one element selected from other group of elements comprising Mg, Fe, Co, Ag, In and As can be added at the amount of 1.0 wt. % or less in total. Furthermore, at least one element selected from a group of elements comprising Zn and Ni can be added at the amount 5.0 wt. % or less in total. Thereby, an corrosion resistant copper alloy tube having better corrosion resistant property against the ant-nest type corrosion which is specific problem for refrigerant tubes and tubes for the heat exchanger and also better brazing property can be provided.

摘要翻译： 这里公开的铜合金管含有0.05〜1.5重量％ Mn含量的氧含量为100ppm以下的脱氧铜。 选自包含P，B，Li，Pb和Sb的一组元素中的至少一种元素可以以0.20wt。 总计％或以下。 另外选自Cr，Ti，Zr，Al和Si的另一组元素中的至少一种元素也可以以0.50wt。 总计％或以下。 此外，可以以1.0重量％的量添加选自包含Mg，Fe，Co，Ag，In和As的其它组元素中的至少一种元素。 总计％或以下。 此外，可以以5.0重量％的量添加选自包含Zn和Ni的一组元素中的至少一种元素。 总计％或以下。 因此，可以提供对于用于热交换器的制冷剂管和管的特定问题，并且具有更好的钎焊性能的抗巢式腐蚀的耐腐蚀性的耐腐蚀铜合金管。

公开(公告)号：US4656003A

公开(公告)日：1987-04-07

申请号：US786482

申请日：1985-10-11

申请人： Motohisa Miyafuji ,  Yasuhiro Nakashima ,  Satoru Katayama ,  Takashi Matsui ,  Hidekazu Harada ,  Youji Yuki

发明人： Motohisa Miyafuji ,  Yasuhiro Nakashima ,  Satoru Katayama ,  Takashi Matsui ,  Hidekazu Harada ,  Youji Yuki

IPC分类号： C22C9/06 ,  C22F1/08

CPC分类号： C22C9/06 ,  C22F1/08

摘要： There is provided a copper alloy which comprises 1.0 to 3.5 wt. % of Ni, 0.2 to 0.9 wt. % of Si, 0.02 to 1.0 wt. % of Mn, 0.1 to 5.0 wt. % of Zn, 0.1 to 2.0 wt. % of Sn, and 0.001 to 0.01 wt. % of Mg, and 0.001 to 0.01 wt. % of one or more members selected from Cr, Ti, and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600.degree. C. at a rate of 5.degree. C. per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400.degree. to 600.degree. C. for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400.degree. to 600.degree. C. for a short time of 5 to 60 seconds.

摘要翻译： 提供了一种铜合金，其包含1.0至3.5重量％ ％的Ni，0.2〜0.9重量％ ％的Si，0.02〜1.0wt。 Mn的％，0.1〜5.0重量％ ％的Zn，0.1〜2.0wt。 的Sn，0.001〜0.01重量％ 的Mg，0.001〜0.01重量％ ％的选自Cr，Ti和Zr中的一种或多种，​​余量基本上为Cu。 铜合金适用于半导体的引线框架，也适用于端子和连接器。 铜合金通过以下方法制造，该方法包括：在所述铜合金的锭的热轧后以5℃/秒以上的速度从高于600℃的温度开始冷却，在400℃的温度下进行退火 在600℃〜600℃下冷却5分钟〜4小时，进行精炼精轧，在400〜600℃的温度下进行5〜60秒的短时间退火。

公开(公告)号：US4822562A

公开(公告)日：1989-04-18

申请号：US930114

申请日：1986-11-13

申请人： Motohisa Miyafuji ,  Isao Hosokawa

发明人： Motohisa Miyafuji ,  Isao Hosokawa

IPC分类号： C22C9/02 ,  C22C9/04 ,  H05K1/09

CPC分类号： C22C9/04 ,  H05K1/09

摘要： A copper alloy excellent in migration resistance comprising from 0.05 to 0.20% by weight of Fe, from 0.02 to 0.05% by weight of P, from 1.0 to 5.0% by weight of Zn, less than 2.5% by weight of Sn and the substantial balance of Cu and impurities. The copper alloy of this invention is excellent in migration resistance as comparable with brass and also excellent in stress corrosion crackings, as well as have higher strength than the copper alloy or the pure copper or the like.

摘要翻译： 具有优异的耐迁移性的铜合金，其含有0.05〜0.20重量％的Fe，0.02〜0.05重量％的P，1.0〜5.0重量％的Zn，小于2.5重量％的Sn， 的Cu和杂质。 本发明的铜合金与黄铜相当，耐迁移性优异，应力腐蚀开裂性优异，并且具有比铜合金或纯铜等更高的强度。

公开(公告)号：US4591484A

公开(公告)日：1986-05-27

申请号：US719453

申请日：1985-04-03

申请人： Motohisa Miyafuji ,  Takashi Matsui ,  Hidekazu Harada

发明人： Motohisa Miyafuji ,  Takashi Matsui ,  Hidekazu Harada

IPC分类号： C22C9/00 ,  C22C9/06 ,  H01L23/00 ,  H01L23/48 ,  H01L23/492

CPC分类号： H01L23/4924 ,  H01L23/48 ,  H01L2924/0002

摘要： A lead material for semiconductor devices comprising from 0.4 to 4.0 wt % of Ni, from 0.1 to 1.0 wt % of Si, from 0.05 to 1.0 wt % of Zn, from 0.01 to 1.0 wt % of Mn, from 0.001 to less than 0.01 wt % of Mg, from 0.001 to less than 0.01 wt % of Cr, up to 0.003 wt % of S, and the balance of Cu and inevitable impurities. The material may further comprise up to 5 ppm of hydrogen and up to 5 ppm of oxygen.

摘要翻译： 一种用于半导体器件的铅材料，包括0.4至4.0重量％的Ni，0.1至1.0重量％的Si，0.05至1.0重量％的Zn，0.01至1.0重量％的Mn，0.001至小于0.01重量％ Mg的百分比，0.001至小于0.01重量％的Cr，至多0.003重量％的S，余量为Cu和不可避免的杂质。 该材料还可以包含高达5ppm的氢和高达5ppm的氧。

公开(公告)号：US06313064B1

公开(公告)日：2001-11-06

申请号：US09339907

申请日：1999-06-25

申请人： Motohisa Miyafuji ,  Yoshinobu Tsuzaki ,  Sadako Yamada ,  Takenori Nakayama ,  Wataru Urushihara

发明人： Motohisa Miyafuji ,  Yoshinobu Tsuzaki ,  Sadako Yamada ,  Takenori Nakayama ,  Wataru Urushihara

IPC分类号： B01J2300

CPC分类号： C22C9/00 ,  A01N59/16 ,  A01N59/20 ,  C22C19/002 ,  C22C19/007 ,  C22C19/03 ,  C22C32/0021 ,  A01N2300/00 ,  A01N25/34 ,  A01N59/00

摘要： A copper alloy comprising 0.1-7.3% of titanium and optionally comprising one or more of zinc, silicon and silver in amounts of 0.001-10%, 0.001-3% and 0.001-1%, respectively, wherein its surface layer contains an oxide containing titanium. This copper alloy exhibits sterilizing effect based on copper and antibacterial effect based on optical catalyst function resulting from the oxide which contains titanium dispersed in the surface layer. The oxide containing titanium can be produced by heating the copper alloy which has the above-mentioned composition and is produced in the usual manner to 200-800° C. to oxidize titanium preferentially. In the case that zinc and silicon are contained, these elements are also preferentially oxidized by the heating, so as to produce oxides. Thus, zinc exhibits antibacterial effect and sterilizing effect. Silicon exhibits hydrophilicity. Silver exhibits sterilizing effect.

摘要翻译： 一种铜合金，其包含0.1-7.3％的钛，并且任选地包含一种或多种锌，硅和银，其量分别为0.001-10％，0.001-3％和0.001-1％，其中其表面层含有含 钛。 该铜合金具有基于铜的杀菌效果和基于由分散在表面层中的钛的氧化物产生的光学催化剂功能的抗菌效果。 含钛的氧化物可以通过加热具有上述组成的铜合金，并以通常的方式制备为200-800℃以优先氧化钛来制备。 在含有锌和硅的情况下，这些元素也优先被加热氧化，从而产生氧化物。 因此，锌具有抗菌效果和杀菌效果。 硅显示亲水性。 银具有消毒作用。